参数资料
| 型号： | 62-2324-2001-8 |
| 厂商： | 3M |
| 文件页数： | 3/8页 |
| 文件大小： | 0K |
| 描述： | TAPE SCOTCH-WELD 4IN X 36YD |
| MSDS 材料安全数据表： | 62-2324-2001-8 MSDS |
| 标准包装： | 10 |
| 系列： | Scotch-Weld™ |
| 胶带类型： | 薄膜 |
| 胶合剂： | 环氧树脂，热固性 |
| 背衬，载体： | 绉纸 |
| 厚度： | 0.0179"?（17.9 密耳，0.455mm） |
| 厚度 - 胶合剂： | 0.0100"（10.0 mils，0.254mm） |
| 厚度 - 背胶，载体，衬垫： | 0.0079"?（7.9 密耳，0.201mm） |
| 宽： | 4.00"（101.60mm）1/3' |
| 长度： | 108'（32.9m）36 码 |
| 颜色： | 灰白 |
| 使用： | 胶合 |
| 温度范围： | 250°F（121°C）- 60 分钟 |
| 包装： | 散装 |
| 其它名称： | Q5481988 |
3
Bonding Film
AF111 for Electronics Applications
Suggested Use
Procedure
(continued)
Typical Overlap Shear
(OLS) Adhesions to
Application of Film to Substrate:
A. Cut a portion of film sufficient for the assembly from the stock roll with
protective liner in place. Note earlier comment to bring adhesive to room
temperature before use.
B. Remove one liner and place the exposed adhesive against the substrate using the
remaining liner as a protective cover.
C. Position film and rub out all air between the adhesive and the substrate. Use of a
rubber roller will facilitate this process.
D. Remove second protective liner.
E. Complete assembly and cure, being careful to avoid trapping air.
Note: The following technical information and data should be considered representative
or typical only and should not be used for specification purposes.
Ultem 1000
Various Substrates
Substrate
Al (etched)
Al (sanded, solvent wiped)
Al (scour pad abraded, solvent wiped)
Al (solvent wiped)
CRS (scour pad abraded, solvent wiped)
Stainless Steel (solvent wiped)
FR-4 (solvent wiped)
LCP (solvent wiped)
Polyimide Film
Polyester Film
Black E-coat
Phenolic Board
?
PEN Plastic
3M? Bonding Film AF111 OLS
5300 psi
3500 psi
3250 psi
3100 psi
2450 psi
450 psi
1150 psi
300 psi
1750 psi
1075 psi
1150 psi
1100 psi
650 psi
450 psi
? OLS values given in psi (pounds per square inch). ASTM D1002.
? Al (aluminum), CRS (cold rolled steel), FR-4 (printed circuit board substrate), LCP (liquid
crystal polymer), and PEN (polyethylene naphthalate).
? Solvent wiped (MEK, alcohol)*; 3M? Scotch-Brite? Scour Pad (green) abraded; sanded
(600 grit sandpaper).
? OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
? Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
? The polyimide and polyester films were overbonded to CRS using 3M? Scotch-Weld?
Epoxy Adhesive DP-190.
*Note: When using solvents, extinguish all ignition sources and follow the
manufacturer’s precautions and directions for use.
-3-
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