参数资料
型号: 62-2324-2001-8
厂商: 3M
文件页数: 4/8页
文件大小: 0K
描述: TAPE SCOTCH-WELD 4IN X 36YD
MSDS 材料安全数据表: 62-2324-2001-8 MSDS
标准包装: 10
系列: Scotch-Weld™
胶带类型: 薄膜
胶合剂: 环氧树脂,热固性
背衬,载体: 绉纸
厚度: 0.0179"?(17.9 密耳,0.455mm)
厚度 - 胶合剂: 0.0100"(10.0 mils,0.254mm)
厚度 - 背胶,载体,衬垫: 0.0079"?(7.9 密耳,0.201mm)
宽: 4.00"(101.60mm)1/3'
长度: 108'(32.9m)36 码
颜色: 灰白
使用: 胶合
温度范围: 250°F(121°C)- 60 分钟
包装: 散装
其它名称: Q5481988
3
Bonding Film
AF111 for Electronics Applications
Typical Peel Adhesion
to Various Substrates
Note: The following technical information and data should be considered representative
or typical only and should not be used for specification purposes.
Substrate
Al (etched)
Al (sanded, solvent wiped)
Al (scour pad abraded, solvent wiped)
Al (solvent wiped)
CRS (scour pad abraded, solvent wiped)
Stainless Steel (solvent wiped)
FR-4 (solvent wiped)
LCP (solvent wiped)
Polyimide Film
Polyester Film
Black E-coat
Phenolic Board
Ultem ? 1000
PEN Plastic
Borosilicate Glass
3M? Bonding Film AF111 Peel
38 piw
36 piw
36 piw
36 piw
35 piw
3 piw
33 piw
3.5 piw
20 piw
3 piw
34 piw
19 piw
26 piw
14 piw
1 piw
? 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate.
? Peel rate 2”/minute.
? Peel values given in piw (pounds per inch width). ASTM D1876.
? Al (aluminum), CRS (cold rolled steel), FR-4 (printed circuit board substrate), LCP (liquid
crystal polymer), and PEN (polyethylene naphthalate).
? Solvent wiped (MEK, alcohol)*; 3M? Scotch-Brite? Scour Pad (green) abraded; sanded
(600 grit sandpaper).
? Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
? The polyimide and polyester films were overbonded to CRS using 3M? Scotch-Weld?
Epoxy Adhesive DP-190.
*Note: When using solvents, extinguish all ignition sources and follow the
manufacturer’s precautions and directions for use.
-4-
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