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| 型号： | 73S8009C-DB |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 21/32页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO 73S8009C 32-QFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 系列： | * |
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DS_8009C_025
73S8009C Data Sheet
3.6
Activation and De-activation Sequence
The host controller is fully responsible for the activation sequencing of the smart card signals CLK, RST,
I/O, AUX1 and AUX2. All these signals are held low by the 73S8009C when the card is in the de-
activated state. Upon card activation (the fall of CMDVCC ( #/% )), all the signals are held low by the
73S8009C until RDY goes high. The host should set the signals RSTIN, I/OUC, CLKIN, AUX1UC and
AUX2UC low prior to activating the card and allow RDY to go high before transitioning any of these
signals. In order to initiate activation, the card must be present and OFF must be high.
At t1 (50 ξ s), if RDY=0 or overcurrent, circuit will de-activate (safety feature)
CMDVCC5 or CMDVCC3
VCC
I/OUC
I/O
RDY
RSTIN
RST
CLKIN
Ignored
Ignored
Ignored
t1
VCC valid
I/O = I/OUC if RDY=1
RST = RSTIN if RDY=1
CLK
CLK=CLKIN if RDY=1
I/O, AUX1, AUX2, CLK, RST are held LOW until RDY = 1 and CMDVCCx = 0
Figure 5: Activation Sequence
Deactivation is initiated either by the system controller by setting both CMDVCC ( #/% ) high, or
automatically in the event of hardware faults or assertion of the OFF_ACK signal. Hardware faults are
over-current, under-voltage, and card extraction during the session. The host can manage the I/O
signals, CLKIN, RSTIN, and CMDVCC ( #/% ) to create other de-activation sequences for non-emergency
situations.
The following steps show the deactivation sequence and the timing of the card control signals when the
system controller sets the CMDVCC(x)B high:
1.
2.
3.
4.
RST goes low at the end of time t1.
De-assert CLK at the end of time t2.
I/O goes low at the end of time t3. Exit reception mode.
De-assert internal VCC_ON at the end of time t4. After a delay, VCC is de-asserted.
Note: Since the 73S8009C does not control the waveshape of CLK (it is determined by the input form the
host CLKIN), there is no guarantee that the duty cycle of the last CLK high pulse will conform to duty
cycle requirements during an emergency deactivation.
Rev. 1.5
21
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8009CN | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Combo ISO-7816 and USB Universal Smart Card Interface IC |
| 73S8009CN-32IM/F | 功能描述:输入/输出控制器接口集成电路 ISO7816 & USB Unvrsl Smart Card Interface RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8009CN-32IM/F1 | 功能描述:输入/输出控制器接口集成电路 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8009CN-32IMR/F | 功能描述:输入/输出控制器接口集成电路 ISO7816 & USB Unvrsl Smart Card Interface RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8009CN-32IMR/F1 | 功能描述:输入/输出控制器接口集成电路 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
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