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| 型号： | 73S8010R-IM/F |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 18/25页 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD INTERFACE 32-QFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 490 |
| 控制器类型： | 智能卡接口 |
| 接口： | I²C |
| 电源电压： | 2.7 V ~ 5.5 V |
| 电流 - 电源： | 1.5mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘 |
| 供应商设备封装： | 32-QFN（5x5） |
| 包装： | 管件 |
DS_8010R_022
73S8010R Data Sheet
Rev. 1.6
25
Revision History
Revision
Date
Description
1.0
7/1/2004
First publication.
1.1
11/10/2004
Make revisions to all references of “I/O” as it relates to the pins for the smart
card and microcontroller interfaces, i.e. IO -> I/O and IOUC -> I/OUC. This
is done to insure consistency and follow the designations used in ISO 7816.
Remove the MLP pin numbering in the pin description.
Correct the clock division table under CARD CLOCK.
Change the value of R2 on the typical application schematic. The original
value is 100 K
Ω and the updated value is 10 KΩ. The PRES input has a
high impedance pull down resistor and the 100 K
Ω for R2 is too high to
insure a valid logic level on this input.
1.3
10/26/2005
Remove NDS references in application schematic.
1.5
1/21/2008
Removed leaded package option, replaced 32QFN punched with SAWN,
updated 28SO dimension.
Changed dimension of bottom exposed pad on 32QFN mechanical package
figure.
1.6
8/28/2009
Added Section 6, Related Documentation and Section 7, Contact
Information.
Formatted to the corporate style. Added document number.
Miscellaneous editorial changes.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
This Data Sheet is proprietary to Teridian Semiconductor Corporation (TSC) and sets forth design goals
for the described product. The data sheet is subject to change. TSC assumes no obligation regarding
future manufacture, unless agreed to in writing. If and when manufactured and sold, this product is sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement and limitation of liability. Teridian Semiconductor Corporation
(TSC) reserves the right to make changes in specifications at any time without notice. Accordingly, the
reader is cautioned to verify that a data sheet is current before placing orders. TSC assumes no liability
for applications assistance.
Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618
TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8010R-IMR/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8010R-IMR/F1 | 功能描述:I2C 接口集成电路 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8010R-IMR/F2 | 功能描述:I2C 接口集成电路 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8014BL-IL/F | 制造商:Maxim Integrated Products 功能描述:- Rail/Tube |
| 73S8014BN | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Smart Card Interface |
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