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参数资料
| 型号： | 844256BGT |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | XO, clock |
| 英文描述： | 622.08 MHz, OTHER CLOCK GENERATOR, PDSO24 |
| 封装： | 4.40 X 7.80 MM, 0.92 MM HEIGHT, MO-153, TSSOP-24 |
| 文件页数： | 5/17页 |
| 文件大小： | 390K |
| 代理商： | 844256BGT |
IDT / ICS LVDS FREQUENCY SYNTHESIZER W/FANOUT BUFFER
13
ICS844256BG REV. A NOVEMBER 7, 2008
ICS844256
FEMTOCLOCKS CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER W/INTEGRATED FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS844256.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS844256 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
Power (core)
MAX
= V
DD_MAX
* (I
DD_MAX
+ I
DDA_MAX
) = 3.465V * (160mA + 20mA) = 623.7mW
Power (outputs)
MAX
= V
DDO_MAX
* I
DDO_MAX
= 3.465V * 160mA = 554.5mW
Total Power
_MAX
= 623.7mW + 554.5mW = 1178.1mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air
flow and a multi-layer board, the appropriate value is 32.1°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 1.178W * 32.1°C/W = 107.8°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and
the type of board (multi-layer).
TABLE 7. THERMAL RESISTANCE
θθθθθ
JA
FOR
24-LEAD TSSOP, E-PAD, FORCED CONVECTION
θθθθθ
JA
by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
32.1°C/W
25.5°C/W
24.0°C/W
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 844256CK-24LF | 制造商:Integrated Device Technology Inc 功能描述:LVDS 0.385V 32PIN VFQFN - Rail/Tube |
| 844256CK-24LFT | 制造商:Integrated Device Technology Inc 功能描述:PLL Frequency Synthesizer Single 32-Pin VFQFPN EP T/R 制造商:Integrated Device Technology Inc 功能描述:32 VFQFN (LEAD-FREE) - Tape and Reel |
| 844256DGILF | 功能描述:时钟合成器/抖动清除器 RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| 844256DGILFT | 功能描述:时钟合成器/抖动清除器 RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| 844256DGLF | 功能描述:时钟合成器/抖动清除器 RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
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