参数资料
| 型号： | A1240A-TQ176C |
| 厂商： | Microsemi SoC |
| 文件页数： | 54/54页 |
| 文件大小： | 0K |
| 描述： | IC FPGA 4K GATES 176-TQFP COM |
| 标准包装： | 40 |
| 系列： | ACT™ 2 |
| LAB/CLB数： | 684 |
| 输入/输出数： | 104 |
| 门数： | 4000 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 176-LQFP |
| 供应商设备封装： | 176-TQFP（24x24） |
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ACT 2 Family FPGAs
R e visio n 8
2 -3
Package Thermal Characteristics
The device junction to case thermal characteristic is
θjc, and the junction to ambient air characteristic is
θja. The thermal characteristics for θja are shown with two different air flow rates.
Maximum junction temperature is 150
°C.
A sample calculation of the absolute maximum power dissipation allowed for a PQ160 package at
commercial temperature and still air is as follows:
EQ 1
Power Dissipation
P = [ICC standby + ICCactive] * VCC + IOL * VOL * N + IOH* (VCC – VOH) * M
EQ 2
where:
ICC standby is the current flowing when no inputs or outputs are changing
ICCactive is the current flowing due to CMOS switching.
IOL and IOH are TTL sink/source currents.
VOL and VOH are TTL level output voltages.
N is the number of outputs driving TTL loads to VOL.
M is the number of outputs driving TTL loads to VOH.
An accurate determination of N and M is problematical because their values depend on the family type,
design details, and on the system I/O. The power can be divided into two components: static and active.
Table 2-4 Package Thermal Characteristics
Package Type*
Pin Count
θ
jc
θ
ja
Still Air
θ
ja
300 ft./min.
Units
Ceramic Pin Grid Array
100
5
35
17
°C/W
132
5
30
15
°C/W
176
8
23
12
°C/W
Ceramic Quad Flatpack
172
8
25
15
°C/W
Plastic Quad Flatpack1
100
13
48
40
°C/W
144
15
40
32
°C/W
160
15
38
30
°C/W
Plastic Leaded Chip Carrier
84
12
37
28
°C/W
Very Thin Quad Flatpack
100
12
43
35
°C/W
Thin Quad Flatpack
176
15
32
25
°C/W
Notes: (Maximum Power in Still Air)
1. Maximum power dissipation values for PQFP packages are 1.9 W (PQ100), 2.3 W (PQ144), and 2.4 W
(PQ160).
2. Maximum power dissipation for PLCC packages is 2.7 W.
3. Maximum power dissipation for VQFP packages is 2.3 W.
4. Maximum power dissipation for TQFP packages is 3.1 W.
Max. junction temp. (°C) Max. ambient temp. (°C)
–
θ
ja°C/W
---------------------------------------------------------------------------------------------------------------------------------------
150°C 70°C
–
33°C/W
------------------------------------
2.4 W
==
相关PDF资料 |
PDF描述 |
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| A1240A-TQG176C | IC FPGA 4K GATES 176-TQFP COM |
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| AX1000-1BG729I | IC FPGA AXCELERATOR 1M 729-PBGA |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| A1240A-TQ176I | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:ACT 2 Family FPGAs |
| A1240A-TQ176M | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:ACT 2 Family FPGAs |
| A1240A-TQG160B | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:ACT 2 Family FPGAs |
| A1240A-TQG160C | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:ACT 2 Family FPGAs |
| A1240A-TQG160I | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:ACT 2 Family FPGAs |
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