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参数资料
| 型号： | A1280A-1CQ172E |
| 元件分类： | FPGA |
| 英文描述： | FPGA, 1232 CLBS, 8000 GATES, 60 MHz, CQFP172 |
| 封装： | CAVITY-UP, CERAMIC, QFP-172 |
| 文件页数： | 3/98页 |
| 文件大小： | 2005K |
| 代理商： | A1280A-1CQ172E |
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11
Hi R e l F P GA s
P ack ag e Th er m a l Ch ar ac t e r i st i c s
The device junction to case thermal characteristic is
θ
jc, and
the junction to ambient air characteristic is
θ
ja. The thermal
characteristics for
θ
ja are shown with two different air flow
rates.
Maximum junction temperature is 150°C.
A sample calculation of the absolute maximum power
dissipation allowed for a CPGA 176-pin package at military
temperature is as follows:
P o w e r D i ss ip a t io n
Gener al P o w e r E quat i o n
P = [ICCstandby + ICCactive] * VCC + IOL * VOL * N +
IOH * (VCC – VOH) * M
where:
ICCstandby is the current flowing when no inputs or outputs
are changing.
ICCactive is the current flowing due to CMOS switching.
IOL, IOH are TTL sink/source currents.
VOL, VOH are TTL level output voltages.
N equals the number of outputs driving TTL loads to
VOL.
M equals the number of outputs driving TTL loads to
VOH.
Accurate values for N and M are difficult to determine
because they depend on the family type, on the design, and on
the system I/O. The power can be divided into two
components—static and active.
S tat i c P o w e r Co m ponen t
Actel FPGAs have small static power components that result
in power dissipation lower than that of PALs or PLDs. By
integrating multiple PALs or PLDs into one FPGA, an even
greater reduction in board-level power dissipation can be
achieved.
The power due to standby current is typically a small
component of the overall power. Standby power is calculated
below for commercial, worst-case conditions.
The static power dissipated by TTL loads depends on the
number of outputs driving high or low and the DC load
current. Again, this value is typically small. For instance, a
32-bit bus sinking 4 mA at 0.33V will generate 42 mW with all
outputs driving low, and 140 mW with all outputs driving high.
Ac ti v e P ower Com p o nent
Power dissipation in CMOS devices is usually dominated by
the active (dynamic) power dissipation. This component is
frequency dependent, a function of the logic and the external
I/O. Active power dissipation results from charging internal
chip capacitances of the interconnect, unprogrammed
antifuses, module inputs, and module outputs, plus external
capacitance due to PC board traces and load device inputs.
An additional component of the active power dissipation is
the totempole current in CMOS transistor pairs. The net
effect can be associated with an equivalent capacitance that
Package Type
Pin Count
θ
jc
θ
ja
Still Air
θ
ja
300 ft/min
Units
Ceramic Pin Grid Array
84
132
133
176
207
257
6.0
4.8
4.6
3.5
2.8
33
25
23
21
15
20
16
15
12
10
8
°C/W
Ceramic Quad Flat Pack
84
132
172
196
256
7.8
7.2
6.8
6.4
6.2
40
35
25
23
20
30
25
20
15
10
°C/W
Max. junction temp. (°C) – Max. military temp.
θ
ja (°C/W)
------------------------------------------------------------------------------------------------------------------
150°C – 125°C
23°C/W
------------------------------------
1.1 W
==
Family
ICC
VCC
Power
ACT 3
2 mA
5.25V
10.5 mW
1200XL/3200DX
2 mA
5.25V
10.5 mW
ACT 2
2 mA
5.25V
10.5 mW
ACT 1
3 mA
5.25V
15.8 mW
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| A1460A-PG207E | FPGA, 848 CLBS, 6000 GATES, 85 MHz, CPGA207 |
| A1280A-CQ172E | FPGA, 1232 CLBS, 8000 GATES, 41 MHz, CQFP172 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A1280A-1CQ172M | 制造商:Microsemi Corporation 功能描述:FPGA ACT 2 8K GATES 1232 CELLS 90MHZ 1.0UM 5V 172CQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 140 I/O 172CQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 8K GATES 172-CQFP MIL |
| A1280A-1CQ176B | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ACT2 Family FPGAs |
| A1280A-1CQ176C | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ACT2 Family FPGAs |
| A1280A-1CQ176I | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ACT2 Family FPGAs |
| A1280A-1CQ176M | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ACT2 Family FPGAs |
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