参数资料
型号: A1425A-1PL84C
元件分类: FPGA
英文描述: FPGA, 310 CLBS, 2500 GATES, 150 MHz, PQCC84
封装: PLASTIC, LCC-84
文件页数: 66/68页
文件大小: 489K
代理商: A1425A-1PL84C
1-181
Accelerator Series FPGAs – ACT 3 Family
Architecture
This section of the data sheet is meant to familiarize the user
with the architecture of the ACT 3 family of FPGA devices. A
generic description of the family will be presented first,
followed by a detailed description of the logic blocks, the
routing structure, the antifuses, and the special function
circuits. The on-chip circuitry required to program the
devices is not covered.
Topology
The ACT 3 family architecture is composed of six key
elements: Logic modules, I/O modules, I/O Pad Drivers,
Routing Tracks, Clock Networks, and Programming and Test
Circuits. The basic structure is similar for all devices in the
family, differing only in the number of rows, columns, and
I/Os. The array itself consists of alternating rows of modules
and channels. The logic modules and channels are in the
center of the array; the I/O modules are located along the
array periphery. A simplified floor plan is depicted in
Logic Modules
ACT 3 logic modules are enhanced versions of the 1200XL
family logic modules. As in the 1200XL family, there are two
types of modules: C-modules and S-modules. The C-module is
functionally equivalent to the 1200XL C-module and
implements high fanin combinatorial macros, such as 5-input
AND, 5-input OR, and so on. It is available for use as the CM8
hard macro. The S-module is designed to implement
high-speed sequential functions within a single module.
S-modules consist of a full C-module driving a flip-flop, which
allows an additional level of logic to be implemented without
additional propagation delay. It is available for use as the
DFM8A/B and DLM8A/B hard macros. C-modules and
S-modules are arranged in pairs called module-pairs.
Module-pairs are arranged in alternating patterns and make
up the bulk of the array. This arrangement allows the
placement software to support two-module macros of four
types (CC, CS, SC, and SS). The C-module implements the
following function:
Y = !S1 * !S0 * D00 + !S1 * S0 * D01 + S1 * !S0 * D10 + S1 * S0
* D11
where: S0 = A0 * B0 and S1 = A1 + B1
Figure 1 Generalized Floor Plan of ACT 3 Device
IO
C
S
C
S
IO
C
S
C
S
IO
C
S
C
S
IO
C
BIO IO
IO
BIN S
C
S
IO
BIN S
C
S
IO
BIN S
C
S
IO
CLKM
IO
BIN S
C
IO
C
S
C
S
C
S
IO
C
An Array with
n rows and m columns
Top I/Os
Bottom I/Os
Left I/Os
Right I/Os
Rows
n+1
n
n–1
2
1
0
Channels
n+1
n
n–1
2
1
0
n+2
0
1
2
3
4
5
c–1
c
c+1
m m+1 m+2 m+3
Columns
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A1425A-1PL84I FPGA, 310 CLBS, 2500 GATES, PQCC84
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相关代理商/技术参数
参数描述
A1425A-1PL84I 功能描述:IC FPGA 2500 GATES 84-PLCC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ACT™ 3 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
A1425A-1PLG84C 功能描述:IC FPGA 2500 GATES 84-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ACT™ 3 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
A1425A-1PLG84I 功能描述:IC FPGA 2500 GATES 84-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ACT™ 3 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
A1425A1PQ100C 制造商:Microsemi SOC Products Group 功能描述:Field-Programmable Gate Array, 310 Cell, 100 Pin, Plastic, QFP
A1425A-1PQ100C 功能描述:IC FPGA 2500 GATES 100-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ACT™ 3 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)