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| 型号： | A3959SLP-T |
| 厂商： | Allegro Microsystems Inc |
| 文件页数： | 8/12页 |
| 文件大小： | 0K |
| 描述： | IC MOTOR DRIVER PWM FULL 28TSSOP |
| 标准包装： | 50 |
| 应用： | PWM 电机驱动器 |
| 输出数： | 1 |
| 电流 - 输出： | ±3A |
| 电压 - 负载： | 9.5 V ~ 50 V |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | -20°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SOIC（0.173"，4.40mm 宽）裸露焊盘 |
| 供应商设备封装： | 28-TSSOP 裸露焊盘 |
| 包装： | 管件 |
| 其它名称： | 620-1071 |
A3959
DMOS Full-Bridge PWM Motor Driver
FUNCTIONAL DESCRIPTION (continued)
Current Sensing. To minimize inaccuracies in
sensing the I TRIP current level, which may be caused by
ground trace IR drops, the sense resistor should have an
independent ground return to the ground terminal of the
device. For low-value sense resistors the IR drops in the
PCB sense resistor ’s traces can be signi ? cant and should
be taken into account. The use of sockets should be
avoided as they can introduce variation in R S due to their
contact resistance.
The maximum value of R S is given as R S = 0.5/I TRIP .
Thermal Protection. Circuitry turns off all drivers
when the junction temperature reaches 165°C typically. It
is intended only to protect the device from failures due to
excessive junction temperatures and should not imply that
output short circuits are permitted. Thermal shutdown has
a hysteresis of approximately 15°C.
Layout. A star ground system located close to the driver
is recommended. The printed wiring board should use a
heavy ground plane. For optimum electrical and thermal
performance, the driver should be soldered directly onto
the board. The ground side of R S should have an indi-
vidual path to the ground terminals of the device. This path
should be as short as is possible physically and should not
have any other components connected to it. It is recom-
mended that a 0.1 μ F capacitor be placed between SENSE
and ground as close to the device as possible; the load sup-
ply terminal, V BB , should be decoupled with an electrolyt-
ic capacitor (> 47 μ F is recommended) placed as close to
the device as is possible. On the 28-lead TSSOP package,
the copper ground plane located under the exposed thermal
pad is typically used as a star ground.
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8
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相关代理商/技术参数 |
参数描述 |
|---|---|
| A3959SLP-T | 制造商:Allegro MicroSystems 功能描述:Motor Driver IC |
| A3959SLPTR | 功能描述:IC MOTOR DRIVER PWM FULL 28TSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 电机和风扇控制器，驱动器 系列:- 标准包装:1 系列:- 应用:直流电机驱动器，步进电机驱动器 评估套件:- 输出数:1 或 2 电流 - 输出:750mA 电压 - 负载:10 V ~ 40 V 电源电压:4.5 V ~ 5.5 V 工作温度:-20°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-BFSOP（0.295"，7.50mm 宽） 供应商设备封装:24-SOP 包装:Digi-Reel® 其它名称:MTS62C19A-HS105DKR |
| A3959SLPTR-T | 功能描述:IC MOTOR DRIVER PWM FULL 28TSSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 电机和风扇控制器，驱动器 系列:- 标准包装:1 系列:- 应用:步进电机驱动器，1-2 相，2 相 评估套件:- 输出数:1 电流 - 输出:800mA 电压 - 负载:10 V ~ 28 V 电源电压:4.75 V ~ 5.25 V 工作温度:-20°C ~ 90°C 安装类型:表面贴装 封装/外壳:28-SOP + 2 翼片裸露焊盘 供应商设备封装:28-HSOPHC（15.2x7.9） 包装:剪切带 (CT) 其它名称:869-1268-1 |
| A3960-0000T | 制造商:3M 制造商全称:3M Electronics 功能描述:100 x 100, PCB Two Row |
| A3960-0010T | 制造商:3M 制造商全称:3M Electronics 功能描述:100 x 100, PCB Two Row |
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