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参数资料
| 型号： | A3995SEVTR-T |
| 厂商： | Allegro Microsystems Inc |
| 文件页数： | 7/9页 |
| 文件大小： | 0K |
| 描述： | IC MOTOR DRIVER PWM DUAL 36-QFN |
| 标准包装： | 1 |
| 应用： | PWM 电机驱动器 |
| 输出数： | 2 |
| 电流 - 输出： | 2.4A |
| 电压 - 负载： | 8 V ~ 36 V |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -20°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 36-VFQFN 裸露焊盘 |
| 供应商设备封装： | 36-QFN-EP（6x6） |
| 包装： | 标准包装 |
| 产品目录页面： | 1141 (CN2011-ZH PDF) |
| 其它名称： | 620-1184-6 |
A3995
DMOS Dual Full Bridge PWM Motor Driver
Motor Configurations For applications that require either a
stepper/DC motor driver or dual stepper motor driver, Allegro offers
the A3989 and A3988. These devices are offered in the same QFN
package as the A3995. The A3988 is capable of driving 2 bipolar
stepper motors at output currents up to 1.2 A. The stepper control
logic is industry standard parallel communication. Please refer to
the Allegro website for further information and datasheets about
those devices.
Layout The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A3995 must be soldered directly onto the board. On the under-
side of the A3995 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
Grounding In order to minimize the effects of ground bounce
and offset issues, it is important to have a low impedance single-
point ground, known as a star ground , located very close to the
device. By making the connection between the exposed thermal
pad and the groundplane directly under the A3995, that area
becomes an ideal location for a star ground point.
VBB
A low impedance ground will prevent ground bounce during
high current operation and ensure that the supply voltage remains
stable at the input terminal. The recommended PCB layout shown
in the diagram below, illustrates how to create a star ground
under the device, to serve both as low impedance ground point
and thermal path.
The two input capacitors should be placed in parallel, and as
close to the device supply pins as possible. The ceramic capaci-
tor should be closer to the pins than the bulk capacitor. This is
necessary because the ceramic capacitor will be responsible for
delivering the high frequency current components.
Sense Pins The sense resistors, RS x , should have a very
low impedance path to ground, because they must carry a large
current while supporting very accurate voltage measurements
by the current sense comparators. Long ground traces will cause
additional voltage drops, adversely affecting the ability of the
comparators to accurately measure the current in the windings.
As shown in the layout below, the SENSE x pins have very short
traces to the RS x resistors and very thick, low impedance traces
directly to the star ground underneath the device. If possible,
there should be no other components on the sense circuits.
Note: When selecting a value for the sense resistors, be sure not to
exceed the maximum voltage on the SENSE x pins of ±500 mV.
V BB
CVCP
CCP
CVCP
CIN3
GND
RS1
CCP
GND
RS2
CIN3
1
NC
MODE2
OUT1B
U1
OUT1A
SENSE1
A3995
OUT2A
SENSE2
CIN1
OUT2B
CIN2
RS1
CIN1
OUT1B
VBB
OUT1B
SENSE1
OUT1A
PAD
OUT2B
VBB
OUT2B
SENSE2
OUT2A
RS2
CIN2
NC
NC
OUT1A
CVDD1
GND
OUT2A
CVDD1
VDD
CVDD2
CVDD2
EV package layout shown.
Figure 5. Printed circuit board layout with typical application circuit, shown at right. The copper area directly under the
A3995 (U1) is soldered to the exposed thermal pad on the underside of the device. The thermal vias serve also as electrical
vias, connecting it to the ground plane on the other side of the PCB , so the two copper areas together form the star ground.
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
7
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