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参数资料
| 型号： | A3P1000-FG484II |
| 元件分类： | FPGA |
| 英文描述： | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA484 |
| 封装： | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 |
| 文件页数： | 29/49页 |
| 文件大小： | 5893K |
| 代理商： | A3P1000-FG484II |
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ProASIC3 DC and Switching Characteristics
2- 108
v1.3
Advance v0.3
M7 device information is new.
N/A
Table 2-4 ProASIC3 Globals/Spines/Rows by Device was updated to include the
number or rows in each top or bottom spine.
2-16
EXTFB was removed from Figure 2-24 ProASIC3E CCC Options.
2-24
The "PLL Macro" section was updated. EXTFB information was removed from
this section.
2-15
The CCC Output Peak-to-Peak Period Jitter FCCC_OUT was updated in Table 2-
11 ProASIC3 CCC/PLL Specification
2-29
EXTFB was removed from Figure 2-27 CCC/PLL Macro.
2-28
Table 2-13 ProASIC3 I/O Features was updated.
2-30
The "Hot-Swap Support" section was updated.
2-33
The "Cold-Sparing Support" section was updated.
2-34
"Electrostatic Discharge (ESD) Protection" section was updated.
2-35
The LVPECL specification in Table 2-43 I/O Hot-Swap and 5 V Input Tolerance
Capabilities in ProASIC3 Devices was updated.
2-64
In the Bank 1 area of Figure 2-72, VMV2 was changed to VMV1 and VCCIB2 was
changed to VCCIB1.
2-97
The VJTAG and I/O pin descriptions were updated in the "Pin Descriptions"
section.
2-50
The "JTAG Pins" section was updated.
2-51
"128-Bit AES Decryption" section was updated to include M7 device
information.
2-53
Table 3-6 was updated.
3-6
Table 3-7 was updated.
3-6
In Table 3-11, PAC4 was updated.
3-93-8
Table 3-20 was updated.
3-20
The note in Table 3-32 was updated.
3-27
All Timing Characteristics tables were updated from LVTTL to Register Delays
3-31 to
3-73
The Timing Characteristics for RAM4K9, RAM512X18, and FIFO were updated.
3-85 to
3-90
FTCKMAX was updated in Table 3-110.
3-97
Advance v0.2
Figure 2-11 was updated.
2-9
The "Clock Resources (VersaNets)" section was updated.
2-9
The "VersaNet Global Networks and Spine Access" section was updated.
2-9
The "PLL Macro" section was updated.
2-15
Figure 2-27 was updated.
2-28
Figure 2-20 was updated.
2-19
Table 2-5 was updated.
2-25
Table 2-6 was updated.
2-25
Previous Version
Changes in Current Version (v1.3)
Page
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PDF描述 |
|---|---|
| A3P1000-FGG144II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA144 |
| A3P1000-FGG256II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA256 |
| A3P1000-FGG484II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA484 |
| A3P1000-PQ208II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PQFP208 |
| A3P1000-PQG208II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PQFP208 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A3P1000-FG484M | 制造商:Microsemi Corporation 功能描述:A3P1000-FG484M - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 300 I/O 484FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 1KB FLASH 484FBGA |
| A3P1000-FG484MX223 | 制造商:Microsemi Corporation 功能描述:FPGA PROASIC3 - Trays |
| A3P1000-FG484T | 功能描述:IC FPGA 1KB FLASH 1M 484-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23） |
| A3P1000-FGG144 | 功能描述:IC FPGA 1KB FLASH 1M 144-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| A3P1000-FGG144ES | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
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