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参数资料
| 型号： | A3P1000-FG484II |
| 元件分类： | FPGA |
| 英文描述： | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA484 |
| 封装： | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 |
| 文件页数： | 45/49页 |
| 文件大小： | 5893K |
| 代理商： | A3P1000-FG484II |
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The information described herein is subject to change without notice.
Seiko Instruments Inc. is not responsible for any problems caused by circuits or diagrams described herein
whose related industrial properties, patents, or other rights belong to third parties. The application circuit
examples explain typical applications of the products, and do not guarantee the success of any specific
mass-production design.
When the products described herein are regulated products subject to the Wassenaar Arrangement or other
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相关PDF资料 |
PDF描述 |
|---|---|
| A3P1000-FGG144II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA144 |
| A3P1000-FGG256II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA256 |
| A3P1000-FGG484II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA484 |
| A3P1000-PQ208II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PQFP208 |
| A3P1000-PQG208II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PQFP208 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A3P1000-FG484M | 制造商:Microsemi Corporation 功能描述:A3P1000-FG484M - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 300 I/O 484FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 1KB FLASH 484FBGA |
| A3P1000-FG484MX223 | 制造商:Microsemi Corporation 功能描述:FPGA PROASIC3 - Trays |
| A3P1000-FG484T | 功能描述:IC FPGA 1KB FLASH 1M 484-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23） |
| A3P1000-FGG144 | 功能描述:IC FPGA 1KB FLASH 1M 144-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| A3P1000-FGG144ES | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
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