参数资料
型号: A42MX09-PQ160I
厂商: Microsemi SoC
文件页数: 121/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 14K 160-PQFP
标准包装: 24
系列: MX
输入/输出数: 101
门数: 14000
电源电压: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 160-BQFP
供应商设备封装: 160-PQFP(28x28)
40MX and 42MX FPGA Families
1- 4
R ev isio n 1 1
provides capability to quickly design memory functions with the SRAM blocks. Unused SRAM blocks can
be used to implement registers for other user logic within the design.
Routing Structure
The MX architecture uses vertical and horizontal routing tracks to interconnect the various logic and I/O
modules. These routing tracks are metal interconnects that may be continuous or split into segments.
Varying segment lengths allow the interconnect of over 90% of design tracks to occur with only two
antifuse connections. Segments can be joined together at the ends using antifuses to increase their
lengths up to the full length of the track. All interconnects can be accomplished with a maximum of four
antifuses.
Horizontal Routing
Horizontal routing tracks span the whole row length or are divided into multiple segments and are located
in between the rows of modules. Any segment that spans more than one-third of the row length is
considered a long horizontal segment. A typical channel is shown in Figure 1-6. Within horizontal routing,
dedicated routing tracks are used for global clock networks and for power and ground tie-off tracks. Non-
dedicated tracks are used for signal nets.
Vertical Routing
Another set of routing tracks run vertically through the module. There are three types of vertical tracks:
input, output, and long. Long tracks span the column length of the module, and can be divided into
multiple segments. Each segment in an input track is dedicated to the input of a particular module; each
segment in an output track is dedicated to the output of a particular module. Long segments are
Figure 1-4
A42MX24 and A42MX36 D-Module Implementation
Figure 1-5
A42MX36 Dual-Port SRAM Block
7 Inputs
Hard-Wire to I/O
Feedback to Array
Programmable
Inverter
SRAM Module
32 x 8 or 64 x 4
(256 Bits)
Read
Port
Logic
Write
Port
Logic
RD[7:0]
Routing Tracks
Latches
Read
Logic
[5:0]
RDAD[5:0]
REN
RCLK
Latches
WD[7:0]
Latches
WRAD[5:0]
Write
Logic
MODE
BLKEN
WEN
WCLK
[5:0]
[7:0]
相关PDF资料
PDF描述
A42MX09-1PQ160 IC FPGA MX SGL CHIP 14K 160-PQFP
ASC31DRAS-S734 CONN EDGECARD 62POS .100 R/A PCB
A42MX09-1PQG160 IC FPGA MX SGL CHIP 14K 160-PQFP
A42MX09-PQG160I IC FPGA MX SGL CHIP 14K 160-PQFP
ACC49DREI-S13 CONN EDGECARD 98POS .100 EYELET
相关代理商/技术参数
参数描述
A42MX09-PQ160M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 14K Gates 336 Cells 129MHz/215MHz 0.45um Technology 3.3V/5V 160-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 160PQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 14K 160-PQFP
A42MX09-PQ208A 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:40MX and 42MX Automotive FPGA Families
A42MX09-PQG100 功能描述:IC FPGA 104I/O 100PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP(28x28)
A42MX09-PQG100A 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A42MX09-PQG100I 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)