参数资料
型号: A42MX24-FPL84
厂商: Microsemi SoC
文件页数: 47/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 36K 84-PLCC
标准包装: 16
系列: MX
输入/输出数: 72
门数: 36000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 84-LCC(J 形引线)
供应商设备封装: 84-PLCC(29.31x29.31)
Datasheet Information
3- 2
R ev isio n 1 1
v6.0
(continued)
and
and the tables were updated.
updated.
In the "PQ100" table, Pin 64 (42MX09 and 42MX16) has changed to LP.
In the "PQ160" table, Pin 61 (42MX09, 42MX16, and 42MX64) has changed to LP.
In the "PQ208" table, the following pins changed:
Pin 129 (42MX09, 42MX16, and 42MX64) has changed to LP.
Pin 198 (42MX09) has changed to I/O.
The n the "PQ240" table, Pin 91 (42MX36) has changed to LP.
In the "VQ100" table, Pin 62 (42MX09 and 42MX16) has changed to LP.
In the "TQ176" table, Pin 109 (42MX09 and 42MX16) has changed to LP.
In the "BG272" table, Pin K20 (42MX36) has changed to LP.
v5.1
v5.0
Because the changes in this data sheet are extensive and technical in nature, this
should be viewed as a new document. Please read it as you would a datasheet that is
published for the first time.
ALL
Note that the “Package Characteristics and Mechanical Drawings” section has been
eliminated from the datasheet. The mechanical drawings are now contained in a
separate document, Package Mechanical Drawings, available on the Microsemi SoC
Products Group website.
Revision
Changes
Page
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A42MX24-FPLG84 功能描述:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A42MX24-FPQ160 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A42MX24-FPQ208 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A42MX24-FPQG160 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A42MX24-FPQG208 功能描述:IC FPGA MX SGL CHIP 36K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)