参数资料
型号: A4982SLPTR-T
厂商: Allegro Microsystems Inc
文件页数: 12/20页
文件大小: 0K
描述: IC DRIVER MICROSTEPPING 24-TSSOP
特色产品: A498x Motor Driver Family
标准包装: 1
应用: 步进电机驱动器
输出数: 2
电流 - 输出: 2A
电压 - 负载: 8 V ~ 35 V
电源电压: 3 V ~ 5.5 V
工作温度: -20°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-TSSOP(0.173",4.40mm)裸露焊盘
供应商设备封装: 24-TSSOP 裸露焊盘
包装: 标准包装
其它名称: 620-1352-6
A4982
DMOS Microstepping Driver with Translator
And Overcurrent Protection
Application Layout
Layout . Typical application circuits and layouts are shown in
figures 8 (LP package) and 9 (ET package).The printed circuit
board should use a heavy groundplane. For optimum electrical
and thermal performance, the A4982 must be soldered directly
onto the board. On the underside of the A4982 package is an
exposed pad, which provides a path for enhanced thermal dissipa-
tion. The thermal pad should be soldered directly to an exposed
surface on the PCB. Thermal vias are used to transfer heat to
other layers of the PCB.
In order to minimize the effects of ground bounce and offset
issues, it is important to have a low impedance single-point
ground, known as a star ground , located very close to the device.
By making the connection between the pad and the ground plane
directly under the A4982, that area becomes an ideal location for
a star ground point. A low impedance ground will prevent ground
bounce during high current operation and ensure that the supply
voltage remains stable at the input terminal.
A4982
PCB
The two input capacitors should be placed in parallel, and as
close to the device supply pins as possible. The ceramic capaci-
tor (CIN1) should be closer to the pins than the bulk capacitor
(CIN2). This is necessary because the ceramic capacitor will be
responsible for delivering the high frequency current components.
The sense resistors, RSx , should have a very low impedance
path to ground, because they must carry a large current while
supporting very accurate voltage measurements by the current
sense comparators. Long ground traces will cause additional
voltage drops, adversely affecting the ability of the comparators
to accurately measure the current in the windings. The SENSEx
pins have very short traces to the RSx resistors and very thick,
low impedance traces directly to the star ground underneath the
device. If possible, there should be no other components on the
sense circuits.
Solder
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
Thermal Vias
OUT2B
GND
C5
ROSC
C4
C3
U1
GND
C6
R4
R5
GND
OUT2A
OUT1A
C3
C4
C5
CP1
CP2
VCP
VREG
MS1
A4982
PAD
GND
ENABLE
OUT2B
VBB2
SENSE2
OUT2A
R4
C6
C1
GND
GND
GND
BULK
CAPACITANCE
GND
OUT1B
GND
C1
ROSC
MS2
RESET
ROSC
SLEEP
VDD
STEP
REF
OUT1A
SENSE1
VBB1
OUT1B
DIR
GND
R5
C2
VDD
VBB
C2
V DD
V BB
Figure 8. LP package typical application and circuit layout
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
12
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