参数资料
型号: A4983SETTR-T
厂商: Allegro Microsystems Inc
文件页数: 10/16页
文件大小: 0K
描述: IC MOTOR DRIVER MICROSTEP 28-QFN
标准包装: 1
应用: 步进电机驱动器
输出数: 1
电流 - 输出: ±2A
电压 - 负载: 8 V ~ 35 V
电源电压: 3 V ~ 5.5 V
工作温度: -20°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-VFQFN 裸露焊盘
供应商设备封装: 28-QFN/MLP 裸露焊盘(5x5)
包装: 标准包装
产品目录页面: 1141 (CN2011-ZH PDF)
其它名称: 620-1194-6
A4983
DMOS Microstepping Driver with Translator
Application Layout
Layout The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A4983 must be soldered directly onto the board. On the under-
side of the A4983 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB. Thermal vias
should not have any thermal relief and should be connected to
A low impedance ground will prevent ground bounce during
high current operation and ensure that the supply voltage remains
stable at the input terminal. The recommended PCB layout shown
in the diagram below, illustrates how to create a star ground
under the device, to serve both as low impedance ground point
and thermal path.
internal layers, if available, to maximize the dissipation area.
Grounding In order to minimize the effects of ground bounce
and offset issues, it is important to have a low impedance single-
point ground, known as a star ground , located very close to the
device. By making the connection between the exposed thermal
pad and the groundplane directly under the A4983, that area
becomes an ideal location for a star ground point.
PCB
Thermal Vias
A4983
RS1
RS2
Solder
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
1
C7
OUT2B
ENABLE
GND
A4983
PAD
C9
OUT1B
NC
DIR
C2
V BB
C4
C3
CP1
CP2
VCP
GND
REF
STEP
R2
R3
NC
C6
R6
VDD
R1
C1
C8
V DD
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
10
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
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