参数资料
型号: A4988SETTR-T
厂商: Allegro Microsystems Inc
文件页数: 12/20页
文件大小: 0K
描述: IC MICROSTEPPER MOTOR DRVR 28QFN
特色产品: A498x Motor Driver Family
标准包装: 1
应用: 步进电机驱动器
输出数: 1
电流 - 输出: ±2A
电压 - 负载: 8 V ~ 35 V
电源电压: 3 V ~ 5.5 V
工作温度: -20°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-VFQFN 裸露焊盘
供应商设备封装: 28-QFN/MLP 裸露焊盘(5x5)
包装: 标准包装
其它名称: 620-1343-6
A4988
DMOS Microstepping Driver with Translator
And Overcurrent Protection
Application Layout
Layout . The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A4988 must be soldered directly onto the board. Pins 3 and 18
are internally fused, which provides a path for enhanced thermal
dissipation. Theses pins should be soldered directly to an exposed
surface on the PCB that connects to thermal vias are used to
transfer heat to other layers of the PCB.
In order to minimize the effects of ground bounce and offset
issues, it is important to have a low impedance single-point
ground, known as a star ground , located very close to the device.
By making the connection between the pad and the ground plane
directly under the A4988, that area becomes an ideal location for
a star ground point. A low impedance ground will prevent ground
bounce during high current operation and ensure that the supply
voltage remains stable at the input terminal.
The two input capacitors should be placed in parallel, and as
close to the device supply pins as possible. The ceramic capaci-
tor (CIN1) should be closer to the pins than the bulk capacitor
(CIN2). This is necessary because the ceramic capacitor will be
responsible for delivering the high frequency current components.
The sense resistors, RSx , should have a very low impedance
path to ground, because they must carry a large current while
supporting very accurate voltage measurements by the current
sense comparators. Long ground traces will cause additional
voltage drops, adversely affecting the ability of the comparators
to accurately measure the current in the windings. The SENSEx
pins have very short traces to the RSx resistors and very thick,
low impedance traces directly to the star ground underneath the
device. If possible, there should be no other components on the
sense circuits.
PCB
Thermal Vias
RS1
A4988
RS2
Solder
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
1
C7
OUT2B
ENABLE
GND
A4988
PAD
C9
OUT1B
NC
DIR
C2
V BB
C4
C3
CP1
CP2
VCP
GND
REF
STEP
R2
R3
NC
C6
R6
VDD
R1
C1
C8
V DD
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
12
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