参数资料
型号: A54SX32A-FGG144
厂商: Microsemi SoC
文件页数: 40/108页
文件大小: 0K
描述: IC FPGA SX 48K GATES 144-FBGA
标准包装: 160
系列: SX-A
LAB/CLB数: 2880
输入/输出数: 111
门数: 48000
电源电压: 2.25 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 144-LBGA
供应商设备封装: 144-FPBGA(13x13)
SX-A Family FPGAs
v5.3
2-17
Timing Characteristics
Timing characteristics for SX-A devices fall into three
categories: family-dependent, device-dependent, and
design-dependent.
The
input
and
output
buffer
characteristics are common to all SX-A family members.
Internal routing delays are device-dependent. Design
dependency means actual delays are not determined
until after placement and routing of the user’s design are
complete. The timing characteristics listed in this
datasheet represent sample timing numbers of the SX-A
devices. Design-specific delay values may be determined
by using Timer or performing simulation after successful
place-and-route with the Designer software.
Critical Nets and Typical Nets
Propagation delays are expressed only for typical nets,
which are used for initial design performance evaluation.
Critical net delays can then be applied to the most
timing-critical paths. Critical nets are determined by net
property assignment prior to placement and routing. Up
to 6 percent of the nets in a design may be designated as
critical, while 90 percent of the nets in a design are
typical.
Long Tracks
Some nets in the design use long tracks. Long tracks are
special routing resources that span multiple rows,
columns, or modules.
Long tracks employ three to five
antifuse connections. This increases capacitance and
resistance, resulting in longer net delays for macros
connected to long tracks. Typically, up to 6 percent of
nets in a fully utilized device require long tracks. Long
tracks contribute approximately 4 ns to 8.4 ns delay. This
additional delay is represented statistically in higher
fanout routing delays.
Timing Derating
SX-A devices are manufactured with a CMOS process.
Therefore, device performance varies according to
temperature, voltage, and process changes. Minimum
timing parameters reflect maximum operating voltage,
minimum
operating
temperature,
and
best-case
processing.
Maximum
timing
parameters
reflect
minimum
operating
voltage,
maximum
operating
temperature, and worst-case processing.
Temperature and Voltage Derating Factors
Table 2-13 Temperature and Voltage Derating Factors
(Normalized to Worst-Case Commercial, TJ = 70°C, VCCA = 2.25 V)
VCCA
Junction Temperature (TJ)
–55°C
–40°C
0°C
25°C
70°C
85°C
125°C
2.250 V
0.790.800.870.89
1.001.04
1.14
2.500 V
0.740.750.820.83
0.940.97
1.07
2.750 V
0.680.690.750.77
0.870.90
0.99
相关PDF资料
PDF描述
ABB80DHND CONN EDGECARD 160PS .050 DIP SLD
ACB80DHHN CONN EDGECARD 160PS .050 DIP SLD
ABB80DHHN CONN EDGECARD 160PS .050 DIP SLD
ABB80DHHD CONN EDGECARD 160PS .050 DIP SLD
GBB92DHBT-S329 CONN EDGECARD 184POS R/A .050 SL
相关代理商/技术参数
参数描述
A54SX32A-FGG144A 功能描述:IC FPGA SX 48K GATES 144-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX32A-FGG144I 功能描述:IC FPGA SX 48K GATES 144-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX32A-FGG144M 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 238MHZ 0.25UM/0.22UM 2.5V 144 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 111 I/O 144FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 48K GATES 144FBGA
A54SX32A-FGG256 功能描述:IC FPGA 249I/O 256FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA(23x23) 其它名称:220-1241
A54SX32A-FGG256A 功能描述:IC FPGA SX 48K GATES 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)