eroflex Circuit Technology - Advanced Multichip Modules SCD1659 REV E 5/21/01
128Kx8
CE4
OE
A0 – A16
I/O0-7
I/O8-15
I/O16-23
I/O24-31
88
8
CE3
WE
CE1
CE2
Block Diagram – PGA Type Package(P2,P7) & CQFP(F2,F18)
128Kx8
CE4
OE
A0 – A16
I/O0-7
I/O8-15
I/O16-23
I/O24-31
88
8
CE3 WE4
WE3
WE2
WE1 CE1
CE2
Block Diagram – CQFP(F1)
Pin Description
I/O0-31
Data I/O
A0–16
Address Inputs
WE1–4
Write Enables
CE1–4
Chip Enables
OE
Output Enable
Vcc
Power Supply
GND
Ground
NC
Not Connected
Pin Description
I/O0-31
Data I/O
A0–16
Address Inputs
WE
Write Enable
CE1–4
Chip Enables
OE
Output Enable
Vcc
Power Supply
GND
Ground
NC
Not Connected
General Description
The ACT–S128K32 is a High
Speed 4 megabit CMOS SRAM
Multichip
Module
(MCM)
designed for full temperature
range, military, space, or high
reliability mass memory and
fast cache applications.
The MCM can be organized
as a 128K x 32 bits, 256K x 16
bits or 512k x 8 bits device and
is
input
and
output
TTL
compatible. Writing is executed
when the write enable (WE)
and chip enable (CE) inputs are
low. Reading is accomplished
when WE is high and CE and
output enable (OE) are both
low. Access time grades of
17ns, 20ns, 25ns, 35ns, 45ns
and
55ns
maximum
are
standard.
The +5 Volt power supply
version is standard and the
+3.3 Volt low power model is
available (See ACT-S128K32V
data sheet).
The products are designed for
operation over the temperature
range of -55°C to +125°C and
screened under the full military
environment.
DESC Standard
Military Drawing (SMD) part
numbers
are
released
and
available.
The
ACT-S128K32
is
manufactured
in
Aeroflex’s
80,000ft2
MIL-PRF-38534
certified facility in Plainview,
N.Y.
Features
■ 4 Low Power CMOS 128K x 8 SRAMs in one MCM
■ Overall configuration as 128K x 32
■ Input and Output TTL Compatible
■ 17, 20, 25, 35, 45 & 55ns Access Times, 15ns Available by Special Order
■ Full Military (-55°C to +125°C) Temperature Range
■ +5V Power Supply
■ Choice of 7 Hermetically sealed Co-fired Packages:
● 68–Lead, Low Profile CQFP (F1), 1.56"SQ x .140"max
● 68–Lead, Dual-Cavity CQFP (F2), .88"SQ x .20"max (.18"max thickness
available, contact factory for details)
(Drops into the 68 Lead JEDEC .99"SQ
CQFJ footprint)
● 68–Lead, Single-Cavity CQFP (F18), .94"SQ x .140"max (Drops into the 68
Lead JEDEC .99"SQ CQFJ footprint)
● 66–Lead, PGA-Type (P2,P6 with/without shoulders), 1.185"SQ x .245"max
● 66–Lead, PGA-Type (P7,P3 with/without shoulders), 1.08"SQ x .160"max
■ Internal Decoupling Capacitors
■ DESC SMD# 5962–93187 Released (P2,P3,P6,P7)
5962–95595 Released (F1,F2,F18)
CIRCUIT TECHNOLOGY
www.aeroflex.com
ACT-S128K32 High Speed
4 Megabit SRAM Multichip Module