参数资料
| 型号： | AD5172BRM2.5 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 22/28页 |
| 文件大小： | 0K |
| 描述： | IC POT DUAL 2.5K 256POS 10-MSOP |
| 标准包装： | 50 |
| 接片： | 256 |
| 电阻（欧姆）： | 2.5k |
| 电路数： | 2 |
| 温度系数： | 标准值 35 ppm/°C |
| 存储器类型： | 非易失 |
| 接口： | I²C |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 管件 |
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Data Sheet
AD5172/AD5173
Rev. I | Page 3 of 28
REVISION HISTORY
8/13—Rev. H to Rev. I
Changed VA, VB, VW to GND and Digital Inputs and Output
Voltage to GND Rating to 0.3 V to +7 V or VDD + 0.3 V
(whichever is less); Table 4...............................................................7
Changes to Ordering Guide...........................................................25
4/09—Rev. G to Rev. H
Changes to DC Characteristics—Rheostat Mode Parameter and
to DC Characteristics—Potentiometer Divider Mode Parameter,
Table 1.................................................................................................3
12/08—Rev. F to Rev. G
Changes to OTP Supply Voltage Parameter, Table 1 ....................3
Changes to OTP Supply Voltage Parameter, Table 2 ....................5
Changes to Table 5 and Table 6 .......................................................8
Changes to One-Time Programming (OTP) Section ................15
Changes to Power Supply Considerations Section, Figure 46,
and Figure 46 Caption ....................................................................17
Changes to Ordering Guide...........................................................23
7/08—Rev. E to Rev. F
Changes to Power Supplies Parameter in Table 1 and Table 2 ....3
Updated Fuse Blow Condition to 400 ms Throughout................5
1/08—Rev. D to Rev. E
Changes to Features ..........................................................................1
Changes to General Description .....................................................1
Changes to OTP Supply Voltage and OTP Supply Current in
Table 1.................................................................................................3
Changes to OTP Supply Voltage and OTP Supply Current in
Table 2.................................................................................................5
Added OTP Program Time in Table 3............................................6
Changes to Table 4 ............................................................................7
Changes to Table 5 and Table 6 .......................................................8
Inserted Figure 30............................................................................13
Replaced One-Time Programming (OTP) Section....................15
Replaced Power Supply Considerations Section.........................17
Deleted Device Programming Software Section.........................20
Replaced I2C-Compatible, 2-Wire Serial Bus Section................21
Changes to Ordering Guide...........................................................23
6/06—Rev. C to Rev. D
Changes to Features ..........................................................................1
Changes to One-Time Programming (OTP) Section ................15
Changes to Figure 44 and Figure 45 .............................................17
Changes to Power Supply Considerations Section .....................18
Changes to Figure 46 and Figure 47 .............................................18
Changes to Device Programming Software Section...................19
Updated Outline Dimensions........................................................24
6/05—Rev. B to Rev. C
Added Footnote 8, Footnote 9, and Footnote 10 to Table 1........3
Added Footnote 8 to Table 2............................................................5
Changes to Table 5 and Table 6 .......................................................9
Changes to Power Supply Considerations Section .....................17
Changes to I2C-Compatible 2-Wire Serial Bus Section .............23
Added Level Shifting for Different Voltage Operation Section.......24
Updated Outline Dimensions........................................................25
Changes to Ordering Guide...........................................................25
10/04—Rev. A to Rev. B
Updated Format ................................................................ Universal
Changes to Specifications.................................................................3
Changes to One-Time Programming (OTP) Section ................13
Changes to Power Supply Considerations Section .....................15
Changes to Figure 44 and Figure 45 .............................................15
Changes to Figure 46 and Figure 47 .............................................16
11/03—Rev. 0 to Rev. A
Changes to Electrical Characteristics—2.5 k .............................3
11/03—Revision 0: Initial Version
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| AD5172BRM50 | 功能描述:IC POT DUAL 50K 256POS 10-MSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 标准包装:3,000 系列:DPP 接片:32 电阻（欧姆）:10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行（芯片选择，递增，增/减） 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN（2x3） 包装:带卷 (TR) |
| AD5172BRM50-RL7 | 制造商:Analog Devices 功能描述:Digital Potentiometer 256POS 50KOhm Dual 10-Pin MSOP T/R 制造商:Analog Devices 功能描述:DGTL POTENTIOMETER 256POS 50KOHM DUAL 10MSOP - Tape and Reel |
| AD5172BRMZ10 | 功能描述:IC POT DUAL 10K 256POS 10MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 标准包装:3,000 系列:DPP 接片:32 电阻（欧姆）:10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行（芯片选择，递增，增/减） 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN（2x3） 包装:带卷 (TR) |
| AD5172BRMZ100 | 功能描述:IC DGTL POT DUAL 100K I2C 10MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 接片:256 电阻（欧姆）:100k 电路数:1 温度系数:标准值 35 ppm/°C 存储器类型:非易失 接口:3 线串口 电源电压:2.7 V ~ 5.25 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN-EP（3x3） 包装:剪切带 (CT) 产品目录页面:1399 (CN2011-ZH PDF) 其它名称:MAX5423ETA+TCT |
| AD5172BRMZ100100 | 制造商:Analog Devices 功能描述:AD5172BRM100 256-step dual pot, 100K |
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