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参数资料
| 型号： | AD5175BRMZ-10-RL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 17/20页 |
| 文件大小： | 0K |
| 描述： | IC DGTL POT 1024POS 10K 10MSOP |
| 标准包装： | 1,000 |
| 接片： | 1024 |
| 电阻（欧姆）： | 10k |
| 电路数： | 1 |
| 温度系数： | 标准值 35 ppm/°C |
| 存储器类型： | 非易失 |
| 接口： | I²C |
| 电源电压： | 2.7 V ~ 5.5 V，±2.5 V ~ 2.75 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 带卷 (TR) |
AD5175
Rev. A | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to GND
–0.3 V to +7.0 V
VSS to GND
+0.3 V to 7.0 V
VDD to VSS
7 V
VA, VW to GND
VSS 0.3 V, VDD + 0.3 V
Digital Input and Output Voltage to GND
0.3 V to VDD + 0.3 V
EXT_CAP to VSS
7 V
IA, IW
Pulsed1
Frequency > 10 kHz
±6 mA/d2
Frequency ≤ 10 kHz
±6 mA/√d2
Continuous
±6 mA
Operating Temperature Range3
40°C to +125°C
Maximum Junction Temperature
(TJ Maximum)
150°C
Storage Temperature Range
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
20 sec to 40 sec
Package Power Dissipation
(TJ max TA)/θJA
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A and W terminals at a given
resistance.
2 Pulse duty factor.
3 Includes programming of 50-TP memory.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is defined by JEDEC specification JESD-51 and the value is
dependent on the test board and test environment.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
10-Lead LFCSP
50
3
°C/W
10-Lead MSOP
N/A
°C/W
1 JEDEC 2S2P test board, still air (0 m/sec airflow).
ESD CAUTION
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