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参数资料
| 型号： | AD5420AREZ-REEL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 21/32页 |
| 文件大小： | 0K |
| 描述： | IC DAC 16BIT 1CH SER 24TSSOP |
| 产品培训模块： | Data Converter Fundamentals DAC Architectures |
| 设计资源： | Simplified 16-Bit, 4 mA-to-20 mA Output Solution Using AD5420 (CN0098) |
| 标准包装： | 1,000 |
| 设置时间： | 10µs |
| 位数： | 16 |
| 数据接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 转换器数目： | 1 |
| 电压电源： | 模拟和数字 |
| 功率耗散（最大）： | 950mW |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm）裸露焊盘 |
| 供应商设备封装： | 24-TSSOP 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 输出数目和类型： | 1 电流，单极 |
| 采样率（每秒）： | * |
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AD5410/AD5420
Data Sheet
Rev. F | Page 28 of 32
MICROPROCESSOR INTERFACING
bus that uses a protocol compatible with microcontrollers and
DSP processors. The communication channel is a 3-wire (mini-
mum) interface consisting of a clock signal, a data signal, and a
with data valid on the rising edge of SCLK.
For all interfaces, the DAC output update is initiated on the
rising edge of LATCH. The contents of the registers can be read
using the readback function.
THERMAL AND SUPPLY CONSIDERATIONS
junction temperature of 125°C. It is important that the device
not be operated under conditions that cause the junction tempera-
ture to exceed this value. Excessive junction temperature can
AVDD, while driving the maximum current (24 mA) directly to
ground. In this case, the ambient temperature should be controlled
or AVDD should be reduced.
At the maximum ambient temperature of 85°C, the 24-lead
TSSOP can dissipate 1.14 W, and the 40-Lead LFCSP can
dissipate 1.21 W.
To ensure that the junction temperature does not exceed 125°C
while driving the maximum current of 24 mA directly into
ground (also adding an on-chip current of 4 mA), AVDD should
be reduced from the maximum rating to ensure that the
package is not required to dissipate more power than previously
stated (see Table 21, Figure 53, and Figure 54).
0
0.5
1.0
1.5
2.0
2.5
40
45
50
55
60
65
70
75
80
85
AMBIENT TEMPERATURE (°C)
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
07027-
055
LFCSP
TSSOP
Figure 53. Maximum Power Dissipation vs. Ambient Temperature
65
60
55
50
45
40
35
30
25
35
45
55
65
TSSOP
LFCSP
75
85
AMBIENT TEMPERATURE (°C)
SU
PPL
Y
VO
L
T
A
G
E
(V)
07027-
054
Figure 54. Maximum Supply Voltage vs. Ambient Temperature
Table 21. Thermal and Supply Considerations
Consideration
TSSOP
LFCSP
Maximum Allowed Power
Dissipation When Operating
at an Ambient Temperature
of 85°C
W
1.14
35
85
125
max
=
=
Θ
JA
A
T
J
T
W
1
.2
1
33
85
125
max
=
=
Θ
JA
A
T
J
T
Maximum Allowed Ambient
Temperature When Operating
from a Supply of 40 V/60 V
and Driving 24 mA Directly to
Ground
(
)
C
86
35
028
.
0
40
125
max
°
=
×
=
Θ
×
JA
D
J
P
T
(
)
C
70
33
028
.
0
60
125
max
°
=
×
=
Θ
×
JA
D
J
P
T
Maximum Allowed Supply
Voltage When Operating at
an Ambient Temperature of
85°C and Driving 24 mA
Directly to Ground
V
40
35
028
.
0
85
125
max
=
×
=
Θ
×
JA
DD
A
J
AI
T
V
43
33
028
.
0
85
125
max
=
×
=
Θ
×
JA
DD
A
J
AI
T
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