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参数资料
| 型号： | AD5433YRU-REEL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 18/29页 |
| 文件大小： | 0K |
| 描述： | IC DAC 10BIT MULTIPLYING 20TSSOP |
| 产品培训模块： | Data Converter Fundamentals DAC Architectures |
| 标准包装： | 2,500 |
| 设置时间： | 35ns |
| 位数： | 10 |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 电压电源： | 单电源 |
| 功率耗散（最大）： | 25µW |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 20-TSSOP |
| 包装： | 带卷 (TR) |
| 输出数目和类型： | 2 电流，单极；2 电流，双极 |
| 采样率（每秒）： | 20.4M |
| 配用： | EVAL-AD5433EBZ-ND - BOARD EVAL FOR AD5433 |
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AD5424/AD5433/AD5445
Data Sheet
Rev. D | Page 24 of 28
PCB LAYOUT AND POWER SUPPLY DECOUPLING
In any circuit where accuracy is important, careful consideration of
the power supply and ground return layout helps to ensure the
rated performance. The printed circuit board on which the
that the analog and digital sections are separated and confined
to certain areas of the board. If the DAC is in a system where
multiple devices require an AGND-to-DGND connection, the
connection should be made at one point only. The star ground
point should be established as close as possible to the device.
These DACs should have ample supply bypassing of 10 F in
parallel with 0.1 F on the supply, located as close to the package
as possible and ideally right up against the device. The 0.1 F
capacitor should have low effective series resistance (ESR) and
effective series inductance (ESI), like the common ceramic types
that provide a low impedance path to ground at high frequencies,
to handle transient currents due to internal logic switching. Low
ESR 1 F to 10 F tantalum or electrolytic capacitors should also be
applied at the supplies to minimize transient disturbance and filter
out low frequency ripple.
Fast switching signals such as clocks should be shielded with
digital ground to avoid radiating noise to other parts of the
board and should never be run near the reference inputs.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other. This
reduces the effects of feedthrough through the board. A micro-
strip technique is by far the best, but not always possible with a
double-sided board. In this technique, the component side of
the board is dedicated to the ground plane, while signal traces
are placed on the solder side.
It is good practice to employ compact, minimum lead length
PCB layout design. Leads to the input should be as short as
possible to minimize IR drops and stray inductance.
The PCB metal traces between VREF and RFB should also be
matched to minimize gain error. To maximize high frequency
performance, the I-to-V amplifier should be located as close to
the device as possible.
Table 12. Overview of AD54xx and AD55xx Devices
Part No.
Resolution
No. DACs
INL(LSB)
Interface
Package
Features
8
1
±0.25
Parallel
RU-16, CP-20
10 MHz BW, 17 ns CS pulse width
8
1
±0.25
Serial
RM-10
10 MHz BW, 50 MHz serial
8
2
±0.25
Parallel
RU-20
10 MHz BW, 17 ns CS pulse width
8
2
±0.25
Serial
RU-10
10 MHz BW, 50 MHz serial
8
1
±0.25
Serial
RJ-8
10 MHz BW, 50 MHz serial
10
1
±0.5
Serial
RM-10
10 MHz BW, 50 MHz serial
10
1
±0.5
Parallel
RU-20, CP-20
10 MHz BW, 17 ns CS pulse width
10
2
±0.5
Serial
RU-16
10 MHz BW, 50 MHz serial
10
2
±0.5
Parallel
RU-24
10 MHz BW, 17 ns CS pulse width
10
1
±0.25
Serial
RJ-8
10 MHz BW, 50 MHz serial
12
1
±1
Serial
RM-10
10 MHz BW, 50 MHz serial
12
1
±0.5
Serial
RM-8
50 MHz serial interface
12
2
±1
Serial
RU-24
10 MHz BW, 50 MHz serial
12
2
±1
Parallel
CP-40
10 MHz BW, 17 ns CS pulse width
12
2
±1
Parallel
RU-20, CP-20
10 MHz BW, 17 ns CS pulse width
12
2
±1
Parallel
RU-24
10 MHz BW, 17 ns CS pulse width
12
2
±1
Serial
RU-16
10 MHz BW, 50 MHz serial
12
1
±0.5
Serial
RJ-8, RM-8
10 MHz BW, 50 MHz serial
14
1
±1
Serial
RM-8
10 MHz BW, 50 MHz serial
14
1
±2
Serial
UJ-8, RM-8
10 MHz BW, 50 MHz serial
14
1
±1
Serial
RM-8
4 MHz BW, 50 MHz serial clock
14
1
±1
Parallel
RU-28
4 MHz BW, 20 ns WR pulse width
14
2
±1
Serial
RM-8
4 MHz BW, 50 MHz serial clock
14
2
±1
Parallel
RU-38
4 MHz BW, 20 ns WR pulse width
16
1
±2
Serial
RM-8
4 MHz BW, 50 MHz serial clock
16
1
±2
Parallel
RU-28
4 MHz BW, 20 ns WR pulse width
16
2
±2
Serial
RU-16
4 MHz BW, 50 MHz serial clock
16
2
±2
Parallel
RU-38
4 MHz BW, 20 ns WR pulse width
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD5433YRU-REEL7 | 制造商:Analog Devices 功能描述:DAC 1-CH R-2R 10-bit 20-Pin TSSOP T/R 制造商:Analog Devices 功能描述:DAC 1CH R-2R 10-BIT 20TSSOP - Tape and Reel |
| AD5433YRUZ | 功能描述:IC DAC 10BIT MULTIPLYING 20TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:1 系列:- 设置时间:4.5µs 位数:12 数据接口:串行，SPI? 转换器数目:1 电压电源:单电源 功率耗散（最大）:- 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOICN 包装:剪切带 (CT) 输出数目和类型:1 电压，单极；1 电压，双极 采样率（每秒）:* 其它名称:MCP4921T-E/SNCTMCP4921T-E/SNRCTMCP4921T-E/SNRCT-ND |
| AD5433YRUZ | 制造商:Analog Devices 功能描述:10BIT DAC PARALLEL I/F SMD 5433 |
| AD5433YRUZ-REEL | 功能描述:IC DAC 10BIT MULTIPLYING 20TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色产品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 标准包装:91 系列:- 设置时间:4µs 位数:10 数据接口:MICROWIRE?，串行，SPI? 转换器数目:8 电压电源:单电源 功率耗散（最大）:2.7mW 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-WFDFN 裸露焊盘 供应商设备封装:14-DFN-EP（4x3） 包装:管件 输出数目和类型:8 电压，单极 采样率（每秒）:* |
| AD5433YRUZ-REEL7 | 功能描述:IC DAC 10BIT MULTIPLYING 20TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色产品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 标准包装:91 系列:- 设置时间:4µs 位数:10 数据接口:MICROWIRE?，串行，SPI? 转换器数目:8 电压电源:单电源 功率耗散（最大）:2.7mW 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-WFDFN 裸露焊盘 供应商设备封装:14-DFN-EP（4x3） 包装:管件 输出数目和类型:8 电压，单极 采样率（每秒）:* |
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