参数资料
| 型号： | AD5532HSABC |
| 厂商： | Analog Devices Inc |
| 文件页数： | 7/12页 |
| 文件大小： | 0K |
| 描述： | IC DAC 14BIT 32CH 74-CSPBGA |
| 产品培训模块： | Data Converter Fundamentals DAC Architectures |
| 标准包装： | 1 |
| 设置时间： | 10µs |
| 位数： | 14 |
| 数据接口： | 串行 |
| 转换器数目： | 34 |
| 电压电源： | 模拟和数字 |
| 功率耗散（最大）： | 623mW |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 74-LBGA，CSPBGA |
| 供应商设备封装： | 74-CSPBGA（12x12） |
| 包装： | 托盘 |
| 输出数目和类型： | 32 电压，单极 |
| 采样率（每秒）： | 1.1M |
| 配用： | EVAL-AD5532HSEBZ-ND - BOARD EVAL FOR AD5532HS EVAL-AD5532EBZ-ND - BOARD EVAL FOR AD5532 |
REV. 0
AD5532HS
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD5532HS features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1, 2
(TA = 25
°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +17 V
VSS to AGND . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –17 V
AVCC to AGND, DAC_GND . . . . . . . . . . . . . –0.3 V to +7 V
DVCC to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Inputs to DGND . . . . . . . . . . –0.3 V to DVCC + 0.3 V
REF_IN to AGND, DAC_GND . . . . . . . . . . . –0.3 V to +7 V
VOUT0–VOUT31 to AGND . . . . . . . VSS – 0.3 V to VDD + 0.3 V
VOUT0–VOUT31 to VSS . . . . . . . . . . . . . . . . . . –0.3 V to +24 V
OFFS_IN to AGND . . . . . . . . . . . VSS – 0.3 V to VDD + 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . 150
°C
74-Lead LFBGA Package,
θJA Thermal Impedance . . . 41°C/W
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
Time at Peak Temperature . . . . . . . . . . . . 10 sec to 40 sec
Max Power Dissipation at TA = 70
°C,
Outputs Loaded . . . . . . . . . . . . . . . . . . . . . . . . . . 550 mW
3
(for TA > 70
°C, derate at 26 mW for each °C over 70°C)
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2 Transient currents of up to 100 mA will not cause SCR latch-up.
3 This limit includes load power and applies only when there is a resistive load on
VOUT outputs.
ORDERING GUIDE
Output
Package
Model
Function
Voltage Span
Description
Option
AD5532HSABC
32 DACs
5 V
74-Ball LFBGA
BC-74
OUTPUT
V
O
L
T
A
GE
DAC CODE
FULL-SCALE
ERROR
ACTUAL
IDEAL
OFFSET
ERROR
16k
0
Figure 2. DAC Transfer Function (OFFS_IN = 0)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD5532HSABCZ | 功能描述:IC DAC 14BIT 32CH HS 74-CSPBGA RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1,000 系列:- 设置时间:1µs 位数:8 数据接口:串行 转换器数目:8 电压电源:双 ± 功率耗散（最大）:941mW 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC W 包装:带卷 (TR) 输出数目和类型:8 电压，单极 采样率（每秒）:* |
| AD5533 | 制造商:AD 制造商全称:Analog Devices 功能描述:32-Channel Infinite Sample-and-Hold |
| AD5533ABC-1 | 制造商:Analog Devices 功能描述:Sample and Hold 32-CH 16us 74-Pin CSP-BGA |
| AD5533ABC-1REEL | 制造商:Analog Devices 功能描述:Sample and Hold 32-CH 16us 74-Pin CSP-BGA T/R |
| AD5533ABCZ-1 | 制造商:Analog Devices 功能描述:Sample and Hold 32-CH 16us 74-Pin CSP-BGA |
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