参数资料
型号: AD768AR
厂商: Analog Devices Inc
文件页数: 3/20页
文件大小: 0K
描述: IC DAC 16BIT 30MSPS 28-SOIC
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 1
设置时间: 25ns
位数: 16
数据接口: 并联
转换器数目: 1
电压电源: 双 ±
功率耗散(最大): 600mW
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-SOIC(0.295",7.50mm 宽)
供应商设备封装: 28-SOIC W
包装: 管件
输出数目和类型: 2 电流,单极;2 电流,双极
采样率(每秒): 40M
AD768
REV. B
–11–
For the values given in Figure 24, I3 equals 4 mA, which results
in a nominal unipolar output swing of 0 V to 2 V. Note, since
A1 has an inverting gain of approximately –4 and a noise gain of
+5, A1’s distortion and noise performance should be considered.
1
27
28
AD768
RFB
500
IOUTA
LADCOM
IOUTB
RFF
100
RL
24.9
RP
20
I1
I2
I3
A1
Figure 24. 0 V to 2 V Buffered Unipolar Output Using a
Current Divider
Bipolar Configuration
Bipolar mode is accomplished by providing an offset current,
IBIPOLAR, to the I/V amplifier’s (A1) summing junction. By set-
ting IBIPOLAR to exactly half the full-scale current flowing
through RFB, the resulting output voltage will be symmetrical
about the summing junction voltage, typically ground. Figure 25
shows the implementation for a bipolar
±2.5 V buffered voltage
output. The resistor divider sets the full-scale current for IDAC to
5 mA. The internal 2.5 V reference generates a 2.5 mA IBIPOLAR
current across RBIP. An output voltage of 0 V is produced when
the DAC is set to half scale (100. . .0) such that the 2.5 mA cur-
rent, IDAC, is exactly offset by IBIPOLAR. As the DAC is varied
from zero to full-scale, the output voltage swings from –2.5 V to
+2.5 V. Note, in configurations that require more than 15 mA
of total current from REFOUT, an external buffer is required.
Op amps such as the AD811, AD8001, and AD9631 are good
selections for superior dynamic performance. In dc applications,
op amps such as the AD845 or AD797 may be more appropriate.
27
AD768
RFB
1k
IOUTA
LADCOM
IOUTB
75
24.9
RP
20
A1
C
3
IBIPOLAR
RBIP
1k
REFOUT
IDAC
28
1
Figure 25. Bipolar
±2.5 V Buffered Voltage Output
DIFFERENTIAL OUTPUT CONFIGURATIONS
AC Coupling via a Transformer
Applications that do not require baseband operation typically
use transformer coupling. Transformer coupling the comple-
mentary outputs of the AD768 to a load has the inherent benefit
of providing electrical isolation while consuming no additional
power. Also, a properly applied transformer should not degrade
the AD768’s output signal with respect to noise and distortion,
since the transformer is a passive device. Figure 26 shows a
center-tapped output transformer that provides the necessary dc
load conditions at the outputs IOUTA and IOUTB to drive a
±0.5 V signal into a 50 load. In this particular circuit, the cen-
ter-tapped transformer has an impedance ratio of 4 that corre-
sponds to a turns ratio of 2. Hence, any load, RL, referred to the
primary side is multiplied by a factor of 4 (i.e., in this case
200
). To avoid dc current from flowing into the R-2R ladder
of the DAC, the center tap of the transformer should be con-
nected to LADCOM.
In order to comply with the minimum voltage compliance of
–1.2 V, the maximum differential resistance seen between
IOUTA and IOUTB should not exceed 240
. Note that the
differential resistance consists of the load RL, referred to the
primary side of the transformer in parallel with any added differ-
ential resistance, RDIFF, across the two outputs. RDIFF is typically
added to the primary side of the transformer to match the effec-
tive primary source impedance to the load (i.e., in this case
200
).
1
27
AD768
IOUTA
LADCOM
IOUTB
RDIFF
200
T1
RL
50
4:1 IMPEDANCE
RATIO
T1 = MINI-CIRCUITS T4-6T
28
Figure 26. Differential Output Using a Transformer
DC COUPLING VIA AN AMPLIFIER
A dc differential to single-ended conversion can be easily ac-
complished using the circuit shown in Figure 27. This circuit
will attenuate both ac and dc common-mode error sources due
to the differential nature of the circuit. Thus, common-mode
noise (i.e., clock feedthrough) as well as dc unipolar offset errors
will be significantly reduced. Also, excellent temperature stabil-
ity can be obtained by using temperature tracking, thin film
resistors for R and RREF. The design equations for the circuit are
provided such that the voltage output swing and IREF can be
optimized for a given application.
1
27
28
AD768
R*
IOUTA
LADCOM
IOUTB
RREF*
IREF
A1
R*
6
3
REFOUT
REFIN
VOUT
VOUT = ±4 IREF R
WHERE IREF =
2.5V
RREF
VOUT ± 2V
R = 200
RREF = 5 x 200
*OHMTEK TDP-1403
Figure 27. DC Differential to Single-Ended Conversion
POWER AND GROUNDING CONSIDERATIONS
In systems seeking to simultaneously achieve high speed and
high accuracy, the implementation and construction of the
printed circuit board design is often as important as the circuit
design. Proper RF techniques must be used in device selection,
placement and routing, and supply bypassing and grounding.
Maintaining low noise on power supplies and ground is critical
to obtaining optimum results from the AD768. Figure 28 pro-
vides an illustration of the recommended printed circuit board
ground plane layout which is implemented on the AD768 evalu-
ation board.
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