参数资料
型号: AD7818ARZ-REEL7
厂商: Analog Devices Inc
文件页数: 6/20页
文件大小: 279K
描述: IC ADC 10BIT W/TEMP SENSOR 8SOIC
标准包装: 1,000
功能: 温度监控系统(传感器)
传感器类型: 内部
感应温度: -55°C ~ 125°C
精确度: ±2°C
拓扑: ADC,多路复用器,寄存器库
输出类型: MICROWIRE?,QSPI?,SPI?
输出警报:
输出风扇:
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
REV. C
6
AD7816/AD7817/AD7818
ABSOLUTE MAXIMUM RATINGS
1
(T
A
 = 25癈 unless otherwise noted)
V
DD
 to AGND . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
V
DD
 to DGND . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
Analog Input Voltage to AGND
V
IN1
 to V
IN4
 . . . . . . . . . . . . . . . . . . . 0.3 V to V
DD
 + 0.3 V
Reference Input Voltage to AGND
2
 . . . 0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . . . 0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to DGND . . . . . 0.3 V to V
DD
+ 0.3 V
Storage Temperature Range . . . . . . . . . . . . .65癈 to +150癈
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150癈
TSSOP, Power Dissipation . . . . . . . . . . . . . . . . . . . . 450 mW
?/DIV>
JA
 Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120癈/W
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . 260癈
  Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215癈
  Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220癈
16-Lead SOIC Package, Power Dissipation . . . . . . . . 450 mW
?/DIV>
JA
 Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100癈/W
Lead Temperature, Soldering
  Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215癈
  Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220癈
8-Lead SOIC Package, Power Dissipation . . . . . . . . . .450 mW
?/DIV>
JA
 Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 157癈/W
Lead Temperature, Soldering
  Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215癈
  Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220癈
礢OIC Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
?/DIV>
JA
 Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206癈/W
Lead Temperature, Soldering
  Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215癈
  Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220癈
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
2
If the Reference Input Voltage is likely to exceed V
DD
 by more than 0.3 V (e.g.,
during power-up) and the reference is capable of supplying 30 mA or more, it is
recommended to use a clamping diode between the REF
IN
 pin and V
DD
 pin. The
diagram below shows how the diode should be connected.
REF
IN
V
DD
BAT81
AD7816/AD7817
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