参数资料
| 型号： | AD7927BRU |
| 厂商： | Analog Devices Inc |
| 文件页数： | 19/28页 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT 8CH 200KSPS 20TSSOP |
| 标准包装： | 75 |
| 位数： | 12 |
| 采样率（每秒）： | 200k |
| 数据接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 7.5mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 20-TSSOP |
| 包装： | 管件 |
| 输入数目和类型： | 8 个单端，单极 |
| 配用： | EVAL-AD7927CBZ-ND - BOARD EVALUATION FOR AD7927 |
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AD7927
Data Sheet
Rev. D | Page 26 of 28
APPLICATION HINTS
GROUNDING AND LAYOUT
The AD7927 has very good immunity to noise on the power
supplies as can be seen in Figure 6. However, care should still
be taken with regard to grounding and layout.
The printed circuit board that houses the AD7927 should be
designed such that the analog and digital sections are separated
and confined to certain areas of the board. This facilitates the
use of ground planes that can be separated easily. A minimum
etch technique is generally best for ground planes as it gives the
best shielding. All three AGND pins of the AD7927 should be
sunk in the AGND plane. Digital and analog ground planes
should be joined at only one place. If the AD7927 is in a system
where multiple devices require an AGND to DGND connec-
tion, the connection should still be made at one point only, a
star ground point that should be established as close as possible
to the AD7927.
Avoid running digital lines under the device as these couple
noise onto the die. The analog ground plane should be allowed
to run under the AD7927 to avoid noise coupling. The power
supply lines to the AD7927 should use as large a trace as possi-
ble to provide low impedance paths and reduce the effects of
glitches on the power supply line. Fast switching signals, like
clocks, should be shielded with digital ground to avoid radiating
noise to other sections of the board, and clock signals should
never be run near the analog inputs. Avoid crossover of digital
and analog signals. Traces on opposite sides of the board should
run at right angles to each other. This reduces the effects of
feedthrough through the board. A microstrip technique is by
far the best, but is not always possible with a double-sided
board. In this technique, the component side of the board is
dedicated to ground planes while signals are placed on the
solder side.
Good decoupling is also important. All analog supplies should
be decoupled with 10 μF tantalum in parallel with 0.1 μF capaci-
tors to AGND. To achieve the best from these decoupling
components, they must be placed as close as possible to the
device, ideally right up against the device. The 0.1 μF capacitors
should have low effective series resistance (ESR) and effective
series inductance (ESI), such as the common ceramic types or
surface mount types, which provide a low impedance path to
ground at high frequencies to handle transient currents due to
internal logic switching.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD7927BRU-REEL | 制造商:Analog Devices 功能描述:ADC Single SAR 200ksps 12-bit Serial 20-Pin TSSOP T/R 制造商:Analog Devices 功能描述:ADC SGL SAR 200KSPS 12-BIT SERL 20TSSOP - Tape and Reel |
| AD7927BRU-REEL7 | 制造商:Analog Devices 功能描述:ADC Single SAR 200ksps 12-bit Serial 20-Pin TSSOP T/R |
| AD7927BRUZ | 功能描述:IC ADC 12BIT 8CH 200KSPS 20TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1 系列:microPOWER™ 位数:8 采样率（每秒）:1M 数据接口:串行，SPI? 转换器数目:1 功率耗散（最大）:- 电压电源:模拟和数字 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-VQFN 裸露焊盘（4x4） 包装:Digi-Reel® 输入数目和类型:8 个单端，单极 产品目录页面:892 (CN2011-ZH PDF) 其它名称:296-25851-6 |
| AD7927BRUZ | 制造商:Analog Devices 功能描述:IC 12BIT ADC SMD 7927 TSSOP20 |
| AD7927BRUZ-REEL | 功能描述:IC ADC 12BIT 8CH W/SEQ 20TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:2,500 系列:- 位数:16 采样率（每秒）:15 数据接口:MICROWIRE?，串行，SPI? 转换器数目:1 功率耗散（最大）:480µW 电压电源:单电源 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:38-WFQFN 裸露焊盘 供应商设备封装:38-QFN（5x7） 包装:带卷 (TR) 输入数目和类型:16 个单端，双极；8 个差分，双极 配用:DC1011A-C-ND - BOARD DELTA SIGMA ADC LTC2494 |
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