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| 型号： | AD7938BSUZ-6 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 22/32页 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT 8CHAN 32TQFP |
| 标准包装： | 1 |
| 位数： | 12 |
| 采样率（每秒）： | 625k |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 7.5mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-TQFP |
| 供应商设备封装： | 32-TQFP（7x7） |
| 包装： | 托盘 |
| 输入数目和类型： | 8 个单端，单极；4 个差分，单极；4 个伪差分，单极；7 伪差分，单极 |
| 配用： | EVAL-AD7938CBZ-ND - EVAL BOARD FOR AD7938 |
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Data Sheet
AD7938-6
Rev. C | Page 29 of 32
APPLICATION HINTS
GROUNDING AND LAYOUT
The printed circuit board that houses the AD7938-6 should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. This facilitates the
use of ground planes that can be easily separated. Generally, a
minimum etch technique is best for ground planes since it gives
the best shielding. Digital and analog ground planes should be
joined in only one place, and the connection should be a star
ground point established as close to the ground pins on the
AD7938-6 as possible. Avoid running digital lines under the
device as this couples noise onto the die. The analog ground
plane should be allowed to run under the AD7938-6 to avoid
noise coupling. The power supply lines to the AD7938-6 should
use as large a trace as possible to provide low impedance paths
and reduce the effects of glitches on the power supply line.
Fast switching signals, such as clocks, should be shielded with
digital ground to avoid radiating noise to other sections of the
board, and clock signals should never run near the analog
inputs. Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feedthrough through the
board. A microstrip technique is by far the best but is not
always possible with a double-sided board. In this technique,
the component side of the board is dedicated to ground planes,
while signals are placed on the solder side.
Good decoupling is also important. All analog supplies should
be decoupled with 10 μF tantalum capacitors in parallel with
0.1 μF capacitors to GND. To achieve the best performance
from these decoupling components, they must be placed as
close as possible to the device, ideally right up against the
device. The 0.1 μF capacitors should have low effective series
resistance (ESR) and effective series inductance (ESI), such as
the common ceramic types or surface-mount types, which
provide a low impedance path to ground at high frequencies to
handle transient currents due to internal logic switching.
PCB DESIGN GUIDELINES FOR CHIP SCALE
PACKAGE
The lands on the chip scale package (CP-32-2) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the
pad. This ensures that the solder joint size is maximized. The
bottom of the chip scale package has a thermal pad. The
thermal pad on the printed circuit board should be at least as
large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern. This ensures that
shorting is avoided. Thermal vias can be used on the printed
circuit board thermal pad to improve thermal performance of
the package. If vias are used, they should be incorporated in the
thermal pad at 1.2 mm pitch grid. The via diameter should be
between 0.3 mm and 0.33 mm, and the via barrel should be
plated with 1 oz. copper to plug the via. The user should
connect the printed circuit board thermal pad to AGND.
EVALUATING THE AD7938-6 PERFORMANCE
The recommended layout for the AD7938-6 is outlined in the
evaluation board documentation. The evaluation board
package includes a fully assembled and tested evaluation board,
documentation, and software for controlling the board from the
PC via the evaluation board controller. The evaluation board
controller can be used in conjunction with the AD7938-6
evaluation board, as well as many other Analog Devices evaluation
boards ending in the CB designator, to demonstrate/evaluate
the ac and dc performance of the AD7938-6.
The software allows the user to perform ac (fast Fourier
transform) and dc (histogram of codes) tests on the AD7938-6.
The software and documentation are on the CD that ships with
the evaluation board.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD7938BSUZ-6REEL7 | 功能描述:IC ADC 12BIT 8CHAN 32TQFP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 其它有关文件:TSA1204 View All Specifications 标准包装:1 系列:- 位数:12 采样率（每秒）:20M 数据接口:并联 转换器数目:2 功率耗散（最大）:155mW 电压电源:模拟和数字 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:Digi-Reel® 输入数目和类型:4 个单端，单极；2 个差分，单极 产品目录页面:1156 (CN2011-ZH PDF) 其它名称:497-5435-6 |
| AD7938BSUZ-REEL7 | 功能描述:IC ADC 12BIT 8CHAN 32TQFP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1,000 系列:- 位数:12 采样率（每秒）:300k 数据接口:并联 转换器数目:1 功率耗散（最大）:75mW 电压电源:单电源 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC 包装:带卷 (TR) 输入数目和类型:1 个单端，单极；1 个单端，双极 |
| AD7939 | 制造商:AD 制造商全称:Analog Devices 功能描述:8-Channel, 1.5 MSPS, 12-Bit and 10-Bit Parallel ADCs with a Sequencer |
| AD7939BCP | 制造商:Analog Devices 功能描述:ADC Single SAR 1.5Msps 10-bit Parallel 32-Pin LFCSP EP |
| AD7939BCP-REEL | 制造商:Analog Devices 功能描述:ADC SGL SAR 1.5MSPS 10-BIT PARALLEL 32LFCSP EP - Tape and Reel |
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