参数资料
型号: AD8030ARZ-REEL7
厂商: Analog Devices Inc
文件页数: 14/25页
文件大小: 0K
描述: IC AMP GP R-R DUAL LP 8SOIC
标准包装: 1,000
放大器类型: 通用
电路数: 2
输出类型: 满摆幅
转换速率: 63 V/µs
-3db带宽: 125MHz
电流 - 输入偏压: 1.7µA
电压 - 输入偏移: 2000µV
电流 - 电源: 1.4mA
电流 - 输出 / 通道: 170mA
电压 - 电源,单路/双路(±): 2.7 V ~ 12 V,±1.35 V ~ 6 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
AD8029/AD8030/AD8040
Data Sheet
Rev. B | Page 20 of 24
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
0124
07-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
8
5
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
Figure 56. 8-Lead Standard Small Outline Package, Narrow Body [SOIC_N]
(R-8)
Dimensions shown in millimeters and (inches)
1.30 BSC
COMPLIANT TO JEDEC STANDARDS MO-203-AB
1.00
0.90
0.70
0.46
0.36
0.26
2.20
2.00
1.80
2.40
2.10
1.80
1.35
1.25
1.15
072809-A
0.10 MAX
1.10
0.80
0.40
0.10
0.22
0.08
3
1
2
4
6
5
0.65 BSC
COPLANARITY
0.10
SEATING
PLANE
0.30
0.15
Figure 57. 6-Lead Plastic Surface-Mount Package [SC70]
(KS-6)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-178-BA
SEATING
PLANE
1.95
BSC
0.65 BSC
0.60
BSC
7
6
1
2
3
4
5
3.00
2.90
2.80
3.00
2.80
2.60
1.70
1.60
1.50
1.30
1.15
0.90
0.15 MAX
0.05 MIN
1.45 MAX
0.95 MIN
0.22 MAX
0.08 MIN
0.38 MAX
0.22 MIN
0.60
0.45
0.30
PIN 1
INDICATOR
8
12-16-2008-A
Figure 58. 8-Lead Small Outline Transistor Package [SOT-23]
(RJ-8)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AB
060606-
A
14
8
7
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
8.75 (0.3445)
8.55 (0.3366)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
45°
Figure 59. 14-Lead Standard Small Outline Package [SOIC_N]
(R-14)
Dimensions shown in millimeters and (inches)
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-
A
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 60. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
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