参数资料
| 型号： | AD8193ACPZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 11/16页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH TMDS BUFF 2:1 32LFCSP |
| 标准包装： | 1 |
| 功能： | 开关 |
| 电路： | 1 x 2:1 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 32-LFCSP-VQ |
| 包装： | 托盘 |
AD8193
Rev. 0 | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
AVCC to AVEE
3.7 V
VTTI
AVCC + 0.6 V
VTTO
AVCC + 0.6 V
Internal Power Dissipation
1.2 W
High Speed Input Voltage
AVCC 1.4 V < VIN < AVCC + 0.6 V
High Speed Differential
Input Voltage
2.0 V
Source Select (S_SEL)
AVEE 0.3 V < VIN < AVCC + 0.6 V
Storage Temperature Range
65°C to +125°C
Operating Temperature
Range
40°C to +85°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions: a device soldered
in a 4-layer JEDEC circuit board for surface-mount packages.
θ
JC
is specified for the exposed pad soldered to the circuit board
with no airflow.
Table 3. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
32-Lead LFCSP
47
6.8
°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8193 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition
temperature of the plastic, approximately 150°C. Temporarily
exceeding this limit may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure. To ensure proper operation,
it is necessary to observe the maximum power derating as
determined by the coefficients in Table 3.
ESD CAUTION
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD8193ACPZ-R7 | 功能描述:IC SWITCH TMDS BUFF 2:1 32LFCSP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 标准包装:1,000 系列:- 功能:多路复用器 电路:1 x 4:1 导通状态电阻:- 电压电源:双电源 电压 - 电源，单路/双路(±):±5V 电流 - 电源:7mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| AD8193-EVALZ | 制造商:AD 制造商全称:Analog Devices 功能描述:Buffered 2:1 TMDS Switch |
| AD8194ACPZ | 功能描述:IC TMDS SWITCH BUFF 2:1 32LFCSP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:250 系列:- 功能:开关 电路:单刀单掷 导通状态电阻:48 欧姆 电压电源:单电源 电压 - 电源，单路/双路(±):2.7 V ~ 5.5 V 电流 - 电源:5µA 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:48-LQFP 供应商设备封装:48-LQFP（7x7） 包装:托盘 |
| AD8194ACPZ-R7 | 功能描述:IC SWITCH TMDS BUFF 2:1 32LFCSP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 标准包装:1,000 系列:- 功能:多路复用器 电路:1 x 4:1 导通状态电阻:- 电压电源:双电源 电压 - 电源，单路/双路(±):±5V 电流 - 电源:7mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| AD8194-EVALZ | 制造商:Analog Devices 功能描述:EVAL BD FOR AD8194 - Bulk |
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