参数资料
型号: AD8300ARZ
厂商: Analog Devices Inc
文件页数: 4/8页
文件大小: 0K
描述: IC DAC 12BIT 3V SRL-IN 8-SOIC
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 1
设置时间: 14µs
位数: 12
数据接口: 串行
转换器数目: 1
电压电源: 单电源
功率耗散(最大): 5.1mW
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
输出数目和类型: 1 电压,单极
采样率(每秒): 71k
产品目录页面: 785 (CN2011-ZH PDF)
REV. A
AD8300
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8300 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
*
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
VOUT to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
IOUT Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package Power Dissipation . . . . . . . . . . . . . (TJ Max – TA)/
θ
JA
Thermal Resistance
θ
JA
8-Lead Plastic DIP Package (N-8) . . . . . . . . . . . . . 103
°C/W
8-Lead SOIC Package (SO-8) . . . . . . . . . . . . . . . . 158
°C/W
Maximum Junction Temperature (TJ Max) . . . . . . . . . . 150
°C
Operating Temperature Range . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . . +300
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
PIN CONFIGURATIONS
SO-8
Plastic DIP
1
2
3
4
TOP VIEW
(Not to Scale)
8
7
6
5
AD8300
VDD
CS
CLK
SDI
VOUT
GND
LD
CLR
1
4
8
5
ORDERING GUIDE
Package
Model
INL
Temp
Description
Options
AD8300AN
±2
XIND
8-Lead P-DIP
N-8
AD8300AR
±2
XIND
8-Lead SOIC
SO-8
NOTES
XIND = –40
°C to +85°C.
The AD8300 contains 630 transistors. The die size measures 72 mil
× 65 mil.
PIN DESCRIPTIONS
Pin #
Name
Function
1VDD
Positive power supply input. Specified range
of operation +2.7 V to +5.5 V.
2
CS
Chip Select, active low input. Disables shift
register loading when high. Does not affect
LD operation.
3
CLK
Clock input, positive edge clocks data into
shift register.
4
SDI
Serial Data Input, input data loads directly
into the shift register, MSB first.
5
LD
Load DAC register strobes, active low.
Transfers shift register data to DAC register.
See Truth Table I for operation. Asynchro-
nous active low input.
6
CLR
Resets DAC register to zero condition.
Asynchronous active low input.
7
GND
Analog and Digital Ground.
8VOUT
DAC voltage output, 2.0475 V full scale
with 0.5 mV per bit. An internal tempera-
ture stabilized reference maintains a fixed
full-scale voltage independent of time, tem-
perature and power supply variations.
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SDI
tCSS
tLD1
tCSH
tLD2
CLK
CS
LD
SDI
CLK
CLR
LD
1LSB
ERROR BAND
FS
ZS
tDS
tDH
tCL
tCH
tLDW
tS
tCLRW
tS
VOUT
Figure 3. Timing Diagram
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