参数资料
| 型号： | AD8383ACPZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 10/16页 |
| 文件大小： | 0K |
| 描述： | IC DECIMATING LCD DRIVER 48LFCSP |
| 产品变化通告： | AD8383ACPZ Discontinuation 28/Feb/2012 |
| 标准包装： | 1 |
| 系列： | DecDriver™ |
| 显示器类型： | LCD |
| 接口： | 并联 |
| 电流 - 电源： | 20mA |
| 电源电压： | 9 V ~ 18 V |
| 工作温度： | 0°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 48-LFCSP-VQ（7x7） |
| 包装： | 托盘 |
| 产品目录页面： | 798 (CN2011-ZH PDF) |
AD8383
PCB DESIGN FOR GOOD THERMAL PERFORMANCE
The total maximum power dissipation of the AD8383 is partly
dependent on load. In a 6-channel 60 Hz XGA system running
at a 65 MHz clock rate, the total maximum power dissipation is
1.08 W at an LCD panel input capacitance of 150 pF.
At the maximum specified clock rate of 100 Ms/s, the total
maximum power dissipation can exceed 2 W for large capacitive
Although the maximum safe operating junction temperature is
higher, the AD8383 is 100% tested at a junction temperature of
125°C. Consequently, the maximum guaranteed operating
junction temperature is 125°C. To limit the maximum junction
temperature at or below the guaranteed maximum, the package,
in conjunction with the PCB, must effectively conduct heat
away from the junction.
The AD8383’s LFCSP package is designed to provide superior
thermal characteristics, partly achieved by an exposed die
paddle on the bottom surface of the package. In order to take
full advantage of this feature, the exposed paddle must be in
direct thermal contact with the PCB, which then serves as a
heat sink.
A thermally effective PCB must incorporate a thermal pad and
a thermal via structure. The thermal pad provides a solderable
contact surface on the top surface of the PCB. The thermal via
structure provides a thermal path to the inner and bottom
THERMAL PAD DESIGN
Thermal performance of the AD8383 varies logarithmically
with the contact area between the exposed thermal paddle and
The θ JA (of the AD8383 mounted on a standard JEDEC PCB) is
reduced by approximately 40% as the contact area increases
from 0% (no thermal pad) to 50%. It approaches its specified
value as the contact area (on the JEDEC standard PCB)
approaches 100%.
In order to minimize thermal performance degradation of
production PCBs, the contact area between the thermal pad and
the PCB should be maximized. Therefore, the size of the
thermal pad should match the exposed 5.25 mm × 5.25 mm
paddle size. However, if the PCB design rules require a pad-to-
pad clearance of more than 0.3 mm, the size of the thermal pad
may be reduced to 5 mm × 5 mm. Additionally, a second
thermal pad of the same size should be placed on the bottom
side of the PCB. At least one thermal pad should be in direct
thermal (and electrical) contact with the AVCC plane.
50
45
40
layers of the PCB to remove heat.
35
30
25
0
25
50
75
100
CONTACT AREA (%)
Figure 11. Thermal Performance vs. Contact Area (on a JEDEC PCB)
Table 4. Power Dissipation vs. Load Capacitance and VFS at 100 Ms/s Clock Rate
VFS = 5 V
VFS = 4 V
C LOAD (pF)
150
200
250
300
P QUIESCENT (W)
0.7
0.7
0.7
0.7
P DYNAMIC (W)
0.72
0.96
1.20
1.44
P TOTAL (W)
1.42
1.66
1.90
2.14
P DYNAMIC (W)
0.58
0.77
0.96
1.15
P TOTAL (W)
1.28
1.47
1.66
1.85
Rev. 0 | Page 10 of 16
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD8384 | 制造商:AD 制造商全称:Analog Devices 功能描述:10-Bit, 6-Channel Decimating LCD DecDriver-R with Level Shifters |
| AD8384ASVZ | 功能描述:IC DRIVER LCD 6CH 10BIT 80-TQFP RoHS:是 类别:集成电路 (IC) >> PMIC - 显示器驱动器 系列:DecDriver™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 显示器类型:真空荧光 (VF) 配置:5 x 7（矩阵） 接口:串行 数字或字符:- 电流 - 电源:3.5mA 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:16-SSOP（0.154"，3.90mm 宽） 供应商设备封装:16-QSOP 包装:带卷 (TR) |
| AD8385 | 制造商:AD 制造商全称:Analog Devices 功能描述:10-Bit, 12-Channel Decimating LCD DECDRIVER with Level Shifters |
| AD8385ASVZ | 制造商:Analog Devices 功能描述: |
| AD8386 | 制造商:AD 制造商全称:Analog Devices 功能描述:10-Bit, 12-Channel Output Decimating LCD Driver |
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