参数资料
型号: AD9267BCPZ
厂商: Analog Devices Inc
文件页数: 22/24页
文件大小: 0K
描述: IC MOD SIGMA-DELTA DUAL 64LFCSP
标准包装: 1
类型: 三角积分调制器
应用: 无线通信系统
安装类型: 表面贴装
封装/外壳: 64-VFQFN 裸露焊盘,CSP
供应商设备封装: 64-LFCSP-VQ(9x9)
包装: 托盘
AD9267
Rev. 0 | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Electrical
AVDD to AGND
0.3 V to +2.0 V
DVDD to DGND
0.3 V to +2.0 V
DRVDD to DGND
0.3 V to +3.9 V
AGND to DGND
0.3 V to +0.3 V
AVDD to DRVDD
3.9 V to +2.0 V
CVDD to CGND
0.3 V to +2.0 V
CGND to DGND
0.3 V to +0.3 V
D0±A to D3±A to DGND
0.3 V to +2.0 V
D0±B to D3±B to DGND
0.3 V to +2.0 V
DCO± to DGND
0.3 V to +2.0 V
OR±A, OR±B to DGND
0.3 V to +2.0 V
PDWNA to DGND
0.3 V to +3.9 V
PDWNB to DGND
0.3 V to +3.9 V
PLLMULTx to DGND
0.3 V to +3.9 V
SDIO to DGND
0.3 V to +3.9 V
CSB to AGND
0.3 V to +3.9 V
SCLK to AGND
0.3 V to +3.9 V
VIN±A, VIN±B to AGND
0.3 V to +2.5 V
CLK+, CLK to CGND
0.3 V to +2.0 V
Environmental
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θJA.
Table 6. Thermal Resistance
Package Type
θJA
Unit
64-Lead LFCSP (CP-64-4)
22
°C/W
ESD CAUTION
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