参数资料
| 型号： | ADA4937-1YCPZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 16/29页 |
| 文件大小： | 0K |
| 描述： | IC ADC DIFF DRIVER 16-LFCSP |
| 设计资源： | Driving AD9233/46/54 ADCs in AC-Coupled Baseband Appls (CN0051) |
| 标准包装： | 5,000 |
| 类型： | ADC 驱动器 |
| 应用： | 数据采集 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ |
| 包装： | 带卷 (TR) |
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ADA4937-1/ADA4937-2
Data Sheet
Rev. D | Page 22 of 28
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4937-x is sensitive to the
PCB environment in which it operates. Realizing its superior
performance requires attention to the details of high speed
PCB design. This section shows a detailed example of how
the design issues of the ADA4937-1 were addressed.
The first requirement is a solid ground plane that covers as
much of the board area around the ADA4937-1 as possible.
However, the area near the feedback resistors (RF), input gain
resistors (RG), and the input summing nodes (Pin 2 and Pin 3)
should be cleared of all ground and power planes (see Figure 61).
Clearing the ground and power planes minimizes any stray capa-
citance at these nodes and prevents peaking of the response of
the amplifier at high frequencies.
The thermal resistance, θJA, is specified for the device, including
the exposed pad, soldered to a high thermal conductivity 4-layer
circuit board, as described in EIA/JESD 51-7.
06
59
1-
08
6
Figure 61. Ground and Power Plane Voiding in Vicinity of RF and RG
Bypass the power supply pins as close to the device as possible
and directly to a nearby ground plane. Use high frequency ceramic
chip capacitors. It is recommended that two parallel bypass capaci-
tors (1000 pF and 0.1 μF) be used for each supply with the 1000 pF
capacitor placed closer to the device; further away, provide low
frequency bypassing using 10 μF tantalum capacitors from each
supply to ground.
Signal routing should be short and direct to avoid parasitic
effects. Wherever complementary signals exist, provide a sym-
metrical layout to maximize balanced performance. When
routing differential signals over a long distance, keep PCB
traces close together and twist any differential wiring to mini-
mize loop area. Doing this reduces radiated energy and makes
the circuit less susceptible to interference.
06
59
1-
087
1.30
0.80
1.30
Figure 62. Recommended PCB Thermal Attach Pad Dimensions (mm)
06
59
1-
08
8
0.30
PLATED
VIA HOLE
1.30
GROUND PLANE
POWER PLANE
BOTTOM METAL
TOP METAL
Figure 63. Cross-Section of 4-layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in mm)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADA4937-2YCP-EBZ | 功能描述:BOARD EVAL FOR ADA4937-2YCP RoHS:是 类别:编程器，开发系统 >> 评估板 - 运算放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- |
| ADA4937-2YCPZ-R2 | 制造商:Analog Devices 功能描述:SP AMP DIFF AMP DUAL 5.25V 24LFCSP EP - Tape and Reel 制造商:Analog Devices 功能描述:IC DIFF AMP 1.9GHZ 6000V/ LFCSP-24 制造商:Analog Devices 功能描述:IC, DIFF AMP, 1.9GHZ, 6000V/ uS, LFCSP-24, No. of Amplifiers:2, Input Offset Vol |
| ADA4937-2YCPZ-R7 | 功能描述:IC ADC DRIVER DIFF DUAL 24LFCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 专用 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:60 系列:- 类型:可变增益放大器 应用:CATV 安装类型:表面贴装 封装/外壳:20-WQFN 裸露焊盘 供应商设备封装:20-TQFN-EP（5x5） 包装:托盘 |
| ADA4937-2YCPZ-RL | 功能描述:IC ADC DRIVER DUAL DIFF 24LFCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 专用 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:60 系列:- 类型:可变增益放大器 应用:CATV 安装类型:表面贴装 封装/外壳:20-WQFN 裸露焊盘 供应商设备封装:20-TQFN-EP（5x5） 包装:托盘 |
| ADA4938-1 | 制造商:AD 制造商全称:Analog Devices 功能描述:Ultra-Low Distortion Differential ADC Driver |
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