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参数资料
| 型号： | ADA4950-1YCP-EBZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 16/28页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADA4950-1YCP |
| 标准包装： | 1 |
| 每 IC 通道数： | 1 - 单 |
| 放大器类型： | 差分 |
| 板类型： | 裸（未填充） |
| 已供物品： | 板 |
| 已用 IC / 零件： | 16-LFCSP 封装 |
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Data Sheet
ADA4950-1/ADA4950-2
Rev. A | Page 23 of 28
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4950-x is sensitive to the
PCB environment in which it operates. Realizing its superior
performance requires attention to the details of high speed
PCB design.
The first requirement is a solid ground plane that covers as
much of the board area around the ADA4950-x as possible. The
thermal resistance, θJA, is specified for the device, including the
exposed pad, soldered to a high thermal conductivity 4-layer
circuit board, as described in EIA/JESD51-7.
Bypass the power supply pins as close to the device as possible
and directly to a nearby ground plane. Use high frequency
ceramic chip capacitors. It is recommended that two parallel
bypass capacitors (1000 pF and 0.1 μF) be used for each supply.
Place the 1000 pF capacitor closer to the device. Farther away,
provide low frequency bulk bypassing using 10 μF tantalum
capacitors from each supply to ground.
Signal routing should be short and direct to avoid parasitic
effects. Wherever complementary signals exist, provide a
symmetrical layout to maximize balanced performance. When
routing differential signals over a long distance, keep PCB
traces close together, and twist any differential wiring to
minimize loop area. Doing this reduces radiated energy and
makes the circuit less susceptible to interference.
1.30
0.80
1.30
07
95
7-
0
56
Figure 61. Recommended PCB Thermal Attach Pad (Dimensions in Millimeters)
0.30
PLATED
VIA HOLE
1.30
GROUND PLANE
POWER PLANE
BOTTOM METAL
TOP METAL
07
95
7-
05
7
Figure 62. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADA4950-1YCPZ-R2 | 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single ±5.5V/11V 16-Pin LFCSP EP T/R 制造商:Analog Devices 功能描述:FIXED GAIN 1,2&3 DIFF ADC DRIVER - Tape and Reel 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single }5.5V/11V 16-Pin LFCSP EP |
| ADA4950-1YCPZ-R7 | 功能描述:IC AMP DIFF LP 114MA 16LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 产品培训模块:Differential Circuit Design Techniques for Communication Applications 标准包装:1 系列:- 放大器类型:RF/IF 差分 电路数:1 输出类型:差分 转换速率:9800 V/µs 增益带宽积:- -3db带宽:2.9GHz 电流 - 输入偏压:3µA 电压 - 输入偏移:- 电流 - 电源:40mA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VQFN 裸露焊盘，CSP 供应商设备封装:16-LFCSP-VQ 包装:剪切带 (CT) 产品目录页面:551 (CN2011-ZH PDF) 其它名称:ADL5561ACPZ-R7CT |
| ADA4950-1YCPZ-RL | 功能描述:IC AMP DIFF LP 114MA 16LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:50 系列:- 放大器类型:J-FET 电路数:2 输出类型:- 转换速率:3.5 V/µs 增益带宽积:1MHz -3db带宽:- 电流 - 输入偏压:30pA 电压 - 输入偏移:2000µV 电流 - 电源:200µA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):7 V ~ 36 V，±3.5 V ~ 18 V 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:8-DIP（0.300"，7.62mm） 供应商设备封装:8-PDIP 包装:管件 |
| ADA4950-2 | 制造商:AD 制造商全称:Analog Devices 功能描述:Low Power, Selectable Gain Differential ADC Driver, G = 1, 2, 3 |
| ADA4950-2YCP-EBZ | 功能描述:BOARD EVAL FOR ADA4950-2YCP RoHS:是 类别:编程器，开发系统 >> 评估板 - 运算放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- |
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