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| 型号： | ADG1608BRUZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 2/20页 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLEXER 8X1 16TSSOP |
| 标准包装： | 96 |
| 功能： | 多路复用器 |
| 电路： | 1 x 8:1 |
| 导通状态电阻： | 4.5 欧姆 |
| 电压电源： | 单/双电源 |
| 电压 - 电源，单路/双路(±)： | 3.3 V ~ 16 V，±1.65 V ~ 4 V |
| 电流 - 电源： | 300µA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 管件 |
| 产品目录页面： | 802 (CN2011-ZH PDF) |
ADG1608/ADG1609
Rev. 0 | Page 10 of 20
1
2
3
4
5
6
7
8
EN
VSS
S1A
S4A
S3A
S2A
A0
DA
16
15
14
13
12
11
10
9
GND
VDD
S1B
S4B
DB
S3B
S2B
A1
ADG1609
TOP VIEW
(Not to Scale)
0
83
18-
0
05
Figure 5. ADG1609 Pin Configuration (TSSOP)
08
31
8-
0
06
PIN 1
INDICATOR
1
VSS
2
S1A
3
S2A
4
S3A
11 S1B
12 VDD
10 S2B
9S3B
5
S
4
A
6
D
A
7
S
B
8
S
4B
15
A
0
16
E
N
14
A
1
13
G
N
D
TOP VIEW
(Not to Scale)
ADG1609
NOTES
1. THE EXPOSED PAD IS CONNECTED
INTERNALLY. FOR INCREASED
RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL
CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE SUBSTRATE, VSS.
Figure 6. ADG1609 Pin Configuration (LFCSP)
Table 10. ADG1609 Pin Function Descriptions
Pin No.
TSSOP
LFCSP
Mnemonic
Description
1
15
A0
Logic Control Input.
2
16
EN
Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin
is high, Ax logic inputs determine on switches.
3
1
VSS
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground.
4
2
S1A
Source Terminal 1A. Can be an input or an output.
5
3
S2A
Source Terminal 2A. Can be an input or an output.
6
4
S3A
Source Terminal 3A. Can be an input or an output.
7
5
S4A
Source Terminal 4A. Can be an input or an output.
8
6
DA
Drain Terminal A. Can be an input or an output.
9
7
DB
Drain Terminal B. Can be an input or an output.
10
8
S4B
Source Terminal 4B. Can be an input or an output.
11
9
S3B
Source Terminal 3B. Can be an input or an output.
12
10
S2B
Source Terminal 2B. Can be an input or an output.
13
11
S1B
Source Terminal 1B. Can be an input or an output.
14
12
VDD
Most Positive Power Supply Potential.
15
13
GND
Ground (0 V) Reference.
16
14
A1
Logic Control Input.
N/A
EP
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 11. ADG1609 Truth Table
A1
A0
EN
On Switch Pair
0
None
0
1
0
1
2
1
0
1
3
1
4
1 X = don’t care.
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相关代理商/技术参数 |
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|---|---|
| ADG1608BRUZ | 制造商:Analog Devices 功能描述:IC ANALOG MULTIPLEXER 8 X 1 TSSOP-16 制造商:Analog Devices 功能描述:IC, ANALOG MULTIPLEXER, 8 X 1, TSSOP-16 |
| ADG1608BRUZ-REEL7 | 功能描述:IC MULTIPLEXER 8X1 16TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 其它有关文件:STG4159 View All Specifications 标准包装:5,000 系列:- 功能:开关 电路:1 x SPDT 导通状态电阻:300 毫欧 电压电源:双电源 电压 - 电源，单路/双路(±):±1.65 V ~ 4.8 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:7-WFBGA，FCBGA 供应商设备封装:7-覆晶 包装:带卷 (TR) |
| ADG1609 | 制造商:AD 制造商全称:Analog Devices 功能描述:4.5 Ω RON, 4-/8-Channel ±5 V,+12 V, +5 V, and +3.3 V Multiplexers |
| ADG1609BCPZ | 制造商:Analog Devices 功能描述:4-CHANNEL, DIFFERENTIAL MULTIPLEXER, QCC16 |
| ADG1609BCPZ-REEL7 | 功能描述:IC MULTIPLEXER DL 4X1 16LFCSP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 特色产品:MicroPak? 标准包装:1 系列:- 功能:开关 电路:2 x SPST - NC 导通状态电阻:500 毫欧 电压电源:单电源 电压 - 电源，单路/双路(±):1.4 V ~ 4.3 V 电流 - 电源:150nA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:8-XFDFN 供应商设备封装:8-XSON，SOT833-1 （1.95x1） 包装:Digi-Reel® 其它名称:568-5557-6 |
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