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| 型号： | ADG1608BRUZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 20/20页 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLEXER 8X1 16TSSOP |
| 标准包装： | 96 |
| 功能： | 多路复用器 |
| 电路： | 1 x 8:1 |
| 导通状态电阻： | 4.5 欧姆 |
| 电压电源： | 单/双电源 |
| 电压 - 电源，单路/双路(±)： | 3.3 V ~ 16 V，±1.65 V ~ 4 V |
| 电流 - 电源： | 300µA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 管件 |
| 产品目录页面： | 802 (CN2011-ZH PDF) |
ADG1608/ADG1609
Rev. 0 | Page 9 of 20
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
EN
VSS
S1
S4
S3
S2
A0
D
16
15
14
13
12
11
10
9
A2
GND
VDD
S7
S8
S6
S5
A1
ADG1608
TOP VIEW
(Not to Scale)
0
83
18-
0
03
Figure 3. ADG1608 Pin Configuration (TSSOP)
08
31
8-
0
04
PIN 1
INDICATOR
1
VSS
2
S1
3
S2
4
S3
11 VDD
12 GND
10 S5
9S6
5
S
4
6
D
7
S
8
S
7
15
A
0
16
E
N
14
A
1
13
A
2
TOP VIEW
(Not to Scale)
ADG1608
NOTES
1. THE EXPOSED PAD IS CONNECTED
INTERNALLY. FOR INCREASED
RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL
CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE SUBSTRATE, VSS.
Figure 4. ADG1608 Pin Configuration (LFCSP)
Table 8. ADG1608 Pin Function Descriptions
Pin No.
TSSOP
LFCSP
Mnemonic
Description
1
15
A0
Logic Control Input.
2
16
EN
Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin
is high, Ax logic inputs determine on switches.
3
1
VSS
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground.
4
2
S1
Source Terminal 1. Can be an input or an output.
5
3
S2
Source Terminal 2. Can be an input or an output.
6
4
S3
Source Terminal 3. Can be an input or an output.
7
5
S4
Source Terminal 4. Can be an input or an output.
8
6
D
Drain Terminal. Can be an input or an output.
9
7
S8
Source Terminal 8. Can be an input or an output.
10
8
S7
Source Terminal 7. Can be an input or an output.
11
9
S6
Source Terminal 6. Can be an input or an output.
12
10
S5
Source Terminal 5. Can be an input or an output.
13
11
VDD
Most Positive Power Supply Potential.
14
12
GND
Ground (0 V) Reference.
15
13
A2
Logic Control Input.
16
14
A1
Logic Control Input.
N/A
EP
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG1608 Truth Table
A2
A1
A0
EN
On Switch
0
None
0
1
0
1
2
0
1
0
1
3
0
1
4
1
0
1
5
1
0
1
6
1
0
1
7
1
8
1 X = don’t care.
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相关代理商/技术参数 |
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|---|---|
| ADG1608BRUZ | 制造商:Analog Devices 功能描述:IC ANALOG MULTIPLEXER 8 X 1 TSSOP-16 制造商:Analog Devices 功能描述:IC, ANALOG MULTIPLEXER, 8 X 1, TSSOP-16 |
| ADG1608BRUZ-REEL7 | 功能描述:IC MULTIPLEXER 8X1 16TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:- 其它有关文件:STG4159 View All Specifications 标准包装:5,000 系列:- 功能:开关 电路:1 x SPDT 导通状态电阻:300 毫欧 电压电源:双电源 电压 - 电源，单路/双路(±):±1.65 V ~ 4.8 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:7-WFBGA，FCBGA 供应商设备封装:7-覆晶 包装:带卷 (TR) |
| ADG1609 | 制造商:AD 制造商全称:Analog Devices 功能描述:4.5 Ω RON, 4-/8-Channel ±5 V,+12 V, +5 V, and +3.3 V Multiplexers |
| ADG1609BCPZ | 制造商:Analog Devices 功能描述:4-CHANNEL, DIFFERENTIAL MULTIPLEXER, QCC16 |
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