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| 型号： | ADG3308BCPZ-REEL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 10/20页 |
| 文件大小： | 0K |
| 描述： | IC XLATOR 8CH 1.2-5.5V 20-LFCSP |
| 标准包装： | 1 |
| 逻辑功能： | 变换器，双向 |
| 位数： | 8 |
| 输入类型： | 逻辑 |
| 输出类型： | 逻辑 |
| 数据速率： | 50Mbps |
| 通道数： | 8 |
| 输出/通道数目： | 1 |
| 差分 - 输入:输出： | 无/无 |
| 传输延迟（最大）： | 6ns |
| 电源电压： | 1.15 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 20-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 20-LFCSP-VQ |
| 包装： | 标准包装 |
| 产品目录页面： | 802 (CN2011-ZH PDF) |
| 其它名称： | ADG3308BCPZ-REEL7DKR |
ADG3308/ADG3308-1
Data Sheet
Rev. D | Page 18 of 20
APPLICATIONS
The ADG3308/ADG3308-1 are designed for digital circuits
that operate at different supply voltages; therefore, logic level
translation is required. The lower voltage logic signals are
connected to the A pins, and the higher voltage logic signals
to the Y pins. The ADG3308/ADG3308-1 can provide level
translation in both directions (A→Y or Y→A) on all eight
channels, eliminating the need for a level translator IC for
each direction. The internal architecture allows the ADG3308/
ADG3308-1 to perform bidirectional level translation without
an additional signal to set the direction in which the translation
is made. It also allows simultaneous data flow in both directions
on the same part, for example, when two channels translate in the
A→Y direction while the other two translate in the Y→A
direction. This simplifies the design by eliminating the timing
requirements for the direction signal and reduces the number of
ICs used for level translation.
Figure 40 shows an application where a 3.3 V microprocessor
can read or write data to and from a 1.8 V peripheral device
using an 8-bit bus.
VCCA
A1
A2
A3
A4
EN
GND
Y4
Y3
Y2
Y1
VCCY
M
ICRO
P
RO
CE
S
O
R/
M
IC
R
OC
ON
TR
OLLE
R
/
DS
P
3.3V
1.8V
P
E
RI
P
HE
RAL
DE
V
ICE
100nF
I/OH1
I/OH4
I/OH3
I/OH2
I/OL1
I/OL4
I/OL3
I/OL2
GND
A5
A6
A7
A8
Y8
Y7
Y6
Y5
ADG3308/
ADG3308-1
I/OH5
I/OH8
I/OH7
I/OH6
I/OL5
I/OL8
I/OL7
I/OL6
04865-
056
Figure 40. 1.8 V to 3.3 V 8-Bit Level Translation Circuit
When the application requires level translation between
a microprocessor and multiple peripheral devices, the
ADG3308/ADG3308-1 I/O pins can be three-stated by setting
EN = 0. This feature allows the ADG3308/ADG3308-1 to share
the data buses with other devices without causing contention
issues. Figure 41 shows an application where a 3.3 V micro-
processor is connected to 1.8 V peripheral devices using the
three-state feature.
ADG3308/
ADG3308-1
M
ICRO
P
RO
CE
S
O
R/
M
IC
R
OC
ON
TR
OLLE
R
/
DS
P
I/OH1
CS
3.3V
1.8V
P
E
RI
P
HE
RAL
D
EVI
C
E
1
P
E
RI
P
HE
RAL
D
EVI
C
E
2
100nF
I/OH2
I/OH8
I/OH7
I/OH6
I/OH5
I/OH4
I/OH3
GND
1.8V
100nF
I/OL1
I/OL2
I/OL8
I/OL7
I/OL6
I/OL5
I/OL4
I/OL3
GND
Y1
VCCY
Y2
Y3
Y4
Y5
Y6
Y7
Y8
EN
GND
A8
A7
A6
A5
A4
A3
A2
A1
VCCA
ADG3308/
ADG3308-1
I/OL1
I/OL2
I/OL8
I/OL7
I/OL6
I/OL5
I/OL4
I/OL3
Y1
VCCY
Y2
Y3
Y4
Y5
Y6
Y7
Y8
EN
GND
A8
A7
A6
A5
A4
A3
A2
A1
VCCA
04865-
055
Figure 41. 1.8 V to 3.3 V Level Translation Circuit
Using the Three-State Feature
LAYOUT GUIDELINES
As with any high speed digital IC, the printed circuit board
layout is important in the overall performance of the circuit. Care
should be taken to ensure proper power supply bypass and
return paths for the high speed signals. Each VCC pin (VCCA and
VCCY) should be bypassed using low effective series resistance
(ESR) and effective series inductance (ESI) capacitors placed as
close as possible to the VCCA and VCCY pins. The parasitic induc-
tance of the high speed signal track can cause significant overshoot.
This effect can be reduced by keeping the length of the tracks as
short as possible. A solid copper plane for the return path
(GND) is also recommended.
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