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参数资料
| 型号： | ADM00317 |
| 厂商： | Microchip Technology |
| 文件页数： | 23/86页 |
| 文件大小： | 0K |
| 描述： | BOARD DAUGHTER MCP4706/16/26 |
| 标准包装： | 1 |
| DAC 的数量： | 3 个，每 IC 1 个 |
| 位数： | 8，10，12 |
| 设置时间： | 6µs |
| DAC 型： | 电压 |
| 已供物品： | 子板 |
| 已用 IC / 零件： | MCP4706，MCP4716，MCP4726 |
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2011-2012 Microchip Technology Inc.
DS22272C-page 3
MCP4706/4716/4726
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Voltage on VDD with respect to VSS .......................................................................................................... -0.6V to +6.5V
Voltage on all pins with respect to VSS ..............................................................................................-0.3V to VDD + 0.3V
Input clamp current, IIK (VI < 0, VI > VDD) ............................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ..................................................................................................±20 mA
Maximum input current source/sunk by SDA, SCL pins .......................................................................................... 2 mA
Maximum output current sunk by SDA Output pin ................................................................................................. 25 mA
Maximum current out of VSS pin .............................................................................................................................50 mA
Maximum current into VDD pin ................................................................................................................................50 mA
Maximum current sourced by the VOUT pin ............................................................................................................40 mA
Maximum current sunk by the VOUT pin..................................................................................................................40 mA
Maximum current sunk by the VREF pin ...................................................................................................................40 A
Package power dissipation (TA = +50°C, TJ = +150°C)
SOT-23-6...................................................................................................................................................452 mW
DFN-6...................................................................................................................................................... 1098 mW
Storage temperature ............................................................................................................................... -65°C to +150°C
Ambient temperature with power applied ............................................................................................... -55°C to +125°C
ESD protection on all pins............................................................................................................................
≥ 6 kV (HBM)
......................................................................................................................................................................
≥ 400V (MM)
Maximum Junction Temperature (TJ) ................................................................................................................... +150°C
Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended peri-
ods may affect device reliability.
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