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| 型号： | ADP1714AUJZ-3.0-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/16页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3V .3A 5TSOT |
| 产品培训模块： | Power Line Monitoring |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3V |
| 输入电压： | 最高 5.5V |
| 电压 - 压降（标准）： | 0.17V @ 300mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 300mA（最小值） |
| 电流 - 限制（最小）： | 380mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-5 细型，TSOT-23-5 |
| 供应商设备封装： | TSOT-23-5 |
| 包装： | 标准包装 |
| 产品目录页面： | 794 (CN2011-ZH PDF) |
| 其它名称： | ADP1714AUJZ-3.0-R7DKR |
ADP1712/ADP1713/ADP1714
THERMAL CONSIDERATIONS
To guarantee reliable operation, the junction temperature of the
ADP1712/ADP1713/ADP1714 must not exceed 125°C. To
ensure the junction temperature stays below this maximum value,
the user needs to be aware of the parameters that contribute to
junction temperature changes. These parameters include ambient
temperature, power dissipation in the power device, and thermal
resistances between the junction and ambient air (θ JA ). The θ JA
number is dependent on the package assembly compounds used
and the amount of copper to which the GND pin of the package
140
120
100
80
60
40
MAX T J (DO NOT OPERATE ABOVE THIS POINT)
is soldered on the PCB. Table 5 shows typical θ JA values of the
20
1mA
30mA
100mA
300mA
5-lead TSOT package for various PCB copper sizes.
0
0.5
10mA
1.0
1.5
80mA
2.0
2.5
200mA
3.0
(LOAD CURRENT)
3.5 4.0 4.5
5.0
Table 5.
V IN – V OUT (V)
Copper Size (mm 2 )
θ JA (°C/W)
Figure 33. 500 mm 2 of PCB Copper, T A = 25°C
0 1
50
100
300
500
1
Device soldered to minimum size pin traces.
170
152
146
134
131
140
120
100
80
MAX T J (DO NOT OPERATE ABOVE THIS POINT)
The junction temperature of the ADP1712/ADP1713/ADP1714
can be calculated from the following equation:
60
T J = T A + ( P D × θ JA )
where:
(3)
40
20
T A is the ambient temperature.
P D is the power dissipation in the die, given by
0
0.5
1mA
10mA
1.0
1.5
30mA
80mA
2.0
2.5
100mA
200mA
3.0
300mA
(LOAD CURRENT)
3.5 4.0 4.5
5.0
P D = [( V IN – V OUT ) × I LOAD ] + ( V IN × I GND )
where:
I LOAD is the load current.
I GND is the ground current.
(4)
140
120
V IN – V OUT (V)
Figure 34. 100 mm 2 of PCB Copper, T A = 25°C
MAX T J (DO NOT OPERATE ABOVE THIS POINT)
V IN and V OUT are input voltage and output voltage, respectively.
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
100
80
T J = T A + {[( V IN – V OUT ) × I LOAD ] × θ JA }
(5)
60
As shown in Equation 4, for a given ambient temperature, input-
40
to-output voltage differential, and continuous load current,
there exists a minimum copper size requirement for the PCB to
20
1mA
30mA
100mA
300mA
ensure the junction temperature does not rise above 125°C. The
following figures show junction temperature calculations for
0
0.5
10mA
1.0
1.5
80mA
2.0
2.5
200mA
3.0
(LOAD CURRENT)
3.5 4.0 4.5
5.0
different ambient temperatures, load currents, input-to-output
voltage differentials, and areas of PCB copper.
Rev. A | Page 13 of 16
V IN – V OUT (V)
Figure 35. 0 mm 2 of PCB Copper, T A = 25°C
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