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参数资料
| 型号： | ADP3334ARMZ-REEL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 9/11页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .5A 8MSOP |
| 设计资源： | Broadband Low EVM Direct Conversion Transmitter (CN0134) Broadband Low EVM Direct Conversion Transmitter Using LO Divide-by-2 Modulator (CN0144) |
| 标准包装： | 1 |
| 系列： | anyCAP® |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 1.5 V ~ 10 V |
| 输入电压： | 2.6 V ~ 11 V |
| 电压 - 压降（标准）： | 0.2V @ 500mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 500mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 标准包装 |
| 其它名称： | ADP3334ARMZ-REEL7DKR |
ADP3334
3. The solder mask opening should be about 120 microns
(4.7 mils) larger than the pad size resulting in a minimum
60 micron (2.4 mils) clearance between the pad and the
solder mask.
4. The paste mask opening is typically designed to match the
pad size used on the peripheral pads of the LFCSP package.
This should provide a reliable solder joint as long as the
stencil thickness is about 0.125 mm.
The paste mask for the thermal pad needs to be designed for
the maximum coverage to effectively remove the heat from the
package. However, due to the presence of thermal vias and the
size of the thermal pad, eliminating voids may not be possible.
5. The recommended paste mask stencil thickness is 0.125 mm.
A laser cut stainless steel stencil with trapezoidal walls should
be used.
A “No Clean” Type 3 solder paste should be used for mount-
ing the LFCSP package. Also, a nitrogen purge during the
reflow process is recommended.
6. The package manufacturer recommends that the reflow
temperature should not exceed 220°C and the time above
liquidus is less than 75 seconds. The preheat ramp should be
3°C/second or lower. The actual temperature profile depends
on the board density and must determined by the assembly
house as to what works best.
REV. C
–9 –
Use the following general guidelines when designing printed
circuit boards.
1. Keep the output capacitor as close as possible to the out-
put and ground pins.
2. Keep the input capacitor as close as possible to the input
and ground pins.
3. PC board traces with larger cross sectional areas will remove
more heat from the ADP3334. For optimum heat transfer,
specify thick copper and use wide traces.
4. Use additional copper layers or planes to reduce the
thermal resistance. When connecting to other layers, use
multiple vias if possible.
Shutdown Mode
Applying a TTL high signal to the shutdown (SD) pin or the
input pin will turn the output off. Pulling SD down to 0.4 V or
below or tying it to ground will turn the output on. In shutdown
mode, quiescent current is reduced to much less than 1 μA.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADP3334AR-REEL | 制造商:Analog Devices 功能描述:LDO Regulator Pos 1.5V to 10V 0.8A 8-Pin SOIC N T/R 制造商:Rochester Electronics LLC 功能描述:500 MA ADJUSTABLE ANYCAP LDO - Tape and Reel |
| ADP3334AR-REEL7 | 制造商:Analog Devices 功能描述:LDO Regulator Pos 1.5V to 10V 0.8A 8-Pin SOIC N T/R 制造商:Rochester Electronics LLC 功能描述:500 MA ADJUSTABLE ANYCAP LDO - Tape and Reel |
| ADP3334ARZ | 功能描述:IC REG LDO ADJ .5A 8-SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:anyCAP® 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:3V 输入电压:最高 5.5V 电压 - 压降（标准）:0.12V @ 150mA 稳压器数量:1 电流 - 输出:150mA（最小值） 电流 - 限制（最小）:220mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:带卷 (TR) 其它名称:ADP160AUJZ-3.0-R7TR |
| ADP3334ARZ | 制造商:Analog Devices 功能描述:Linear Voltage Regulator IC 制造商:Analog Devices 功能描述:IC, ADJ LDO REG, 1.5V TO 10V 0.5A 8-SOIC |
| ADP3334ARZ-REEL | 功能描述:IC REG LDO ADJ .5A 8SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:anyCAP® 标准包装:75 系列:- 稳压器拓扑结构:正，可调式 输出电压:1.2 V ~ 37 V 输入电压:4.2 V ~ 40 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:500mA 电流 - 限制（最小）:500mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-252-3，DPak（2 引线+接片），SC-63 供应商设备封装:TO-252-3 包装:管件 产品目录页面:1286 (CN2011-ZH PDF) 其它名称:*LM317AMDT/NOPBLM317AMDT |
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