参数资料
型号: ADSP-21262SKBC-200
厂商: Analog Devices Inc
文件页数: 12/60页
文件大小: 0K
描述: IC DSP 32BIT 200MHZ 136-CSPBGA
产品培训模块: SHARC Processor Overview
标准包装: 1
系列: SHARC®
类型: 浮点
接口: DAI,SPI
时钟速率: 200MHz
非易失内存: ROM(512 kB)
芯片上RAM: 256kB
电压 - 输入/输出: 3.30V
电压 - 核心: 1.20V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 136-LFBGA,CSPBGA
供应商设备封装: 136-CSPBGA(12x12)
包装: 托盘
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 6. Pin Descriptions (Continued)
State During and
Pin
SPICLK
Type
I/O
(pu)
After Reset
Three-state with
pull-up enabled,
driven high in SPI-
master boot mode
Function
Serial Peripheral Interface Clock Signal. Driven by the master, this signal controls the
rate at which data is transferred. The master can transmit data at a variety of baud rates.
SPICLK cycles once for each bit transmitted. SPICLK is a gated clock active during data
transfers, only for the length of the transferred word. Slave devices ignore the serial clock
if the slave select input is driven inactive (high). SPICLK is used to shift out and shift in
the data driven on the MISO and MOSI lines. The data is always shifted out on one clock
edge and sampled on the opposite edge of the clock. Clock polarity and clock phase
relative to data are programmable into the SPICTL control register and define the transfer
format. SPICLK has a 22.5 kΩ internal pull-up resistor.
SPIDS
I Input only
Serial Peripheral Interface Slave Device Select. An active low signal used to select the
processor as an SPI slave device. This input signal behaves like a chip select, and is
provided by the master device for the slave devices. In multimaster mode the processor ’s
SPIDS signal can be driven by a slave device to signal to the processor (as SPI master)
that an error has occurred, as some other device is also trying to be the master device. If
asserted low when the device is in master mode, it is considered a multimaster error. For
a single-master, multiple-slave configuration where flag pins are used, this pin must be
tied or pulled high to V DDEXT on the master device. For processor to processor SPI inter-
action, any of the master processor ’s flag pins can be used to drive the SPIDS signal on
the SPI slave device.
MOSI I/O (O/D)
(pu)
MISO I/O (O/D)
(pu)
Three-state with
pull-up enabled,
driven low in SPI-
master boot mode
Three-state with
pull-up enabled
SPI Master Out Slave In. If the ADSP-2136x is configured as a master, the MOSI pin
becomes a data transmit (output) pin, transmitting output data. If the processor is
configured as a slave, the MOSI pin becomes a data receive (input) pin, receiving input
data. In an SPI interconnection, the data is shifted out from the MOSI output pin of the
master and shifted into the MOSI input(s) of the slave(s). MOSI has a 22.5 kΩ internal pull-
up resistor.
SPI Master In Slave Out. If the ADSP-2136x is configured as a master, the MISO pin
becomes a data receive (input) pin, receiving input data. If the processor is configured
as a slave, the MISO pin becomes a data transmit (output) pin, transmitting output data.
In an SPI interconnection, the data is shifted out from the MISO output pin of the slave
and shifted into the MISO input pin of the master. MISO has a 22.5 kΩ internal pull-up
resistor. MISO can be configured as O/D by setting the OPD bit in the SPICTL register.
Note: Only one slave is allowed to transmit data at any given time. To enable broadcast
transmission to multiple SPI slaves, the processor ’s MISO pin can be disabled by setting
Bit 5 (DMISO) of the SPICTL register equal to 1.
CLKIN I Input only
Local Clock In. Used in conjunction with XTAL. CLKIN is the ADSP-2136x clock input. It
configures the ADSP-2136x to use either its internal clock generator or an external clock
source. Connecting the necessary components to CLKIN and XTAL enables the internal
clock generator. Connecting the external clock to CLKIN while leaving XTAL uncon-
nected configures the processors to use the external clock source such as an external
clock oscillator. The core is clocked either by the PLL output or this clock input depending
on the CLK_CFG1–0 pin settings. CLKIN should not be halted, changed, or operated
below the specified frequency.
XTAL O Output only
CLK_CFG1–0 I Input only
2
Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external crystal.
Core to CLKIN Ratio Control. These pins set the start up clock frequency. Note that the
operating frequency can be changed by programming the PLL multiplier and divider in
the PMCTL register at any time after the core comes out of reset. The allowed values are:
00 = 6:1
01 = 32:1
10 = 16:1
11 = reserved.
The following symbols appear in the Type column of Table 6 : A = asynchronous, G = ground, I = input, O = output, P = power supply,
S = synchronous, ( A/D ) = active drive, ( O/D ) = open drain, and T = three-state, ( pd ) = pull-down resistor, ( pu ) = pull-up resistor.
Rev. J |
Page 12 of 60 |
July 2013
相关PDF资料
PDF描述
MC78L08ABP IC REG LDO 8V .1A TO92
TPSC107K010R0150 CAP TANT 100UF 10V 10% 2312
MC7824BT IC REG LDO 24V 1A TO220AB
ADSP-21489KSWZ-3A IC CCD SIGNAL PROCESSOR 100LQFP
MC7818CT IC REG LDO 18V 1A TO220AB
相关代理商/技术参数
参数描述
ADSP-21262SKBC200R 制造商:Analog Devices 功能描述:DSP Floating-Point 32-Bit 200MHz 200MIPS 136-Pin CSP-BGA T/R
ADSP-21262SKBC-200X 制造商:Analog Devices 功能描述:
ADSP-21262SKBCZ200 功能描述:IC DSP CTLR 32BIT 136CSPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:SHARC® 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C,McASP,McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA,FCBGA 供应商设备封装:548-FCBGA(27x27) 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
ADSP-21262SKBCZ200 制造商:Analog Devices 功能描述:DIGITAL SIGNAL PROCESSOR IC
ADSP21262SKBCZ200R 功能描述:IC DSP CTLR 32BIT 136CSPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:SHARC® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI,以太网,RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA,FCBGA 供应商设备封装:431-FCPBGA(20x20) 包装:托盘