参数资料
型号: ADUC814BRU
厂商: Analog Devices Inc
文件页数: 72/72页
文件大小: 0K
描述: IC ADC 12BIT W/FLASH MCU 28TSSOP
标准包装: 50
系列: MicroConverter® ADuC8xx
核心处理器: 8052
芯体尺寸: 8-位
速度: 16.78MHz
连通性: I²C,SPI,UART/USART
外围设备: POR,PSM,温度传感器,WDT
输入/输出数: 17
程序存储器容量: 8KB(8K x 8)
程序存储器类型: 闪存
EEPROM 大小: 640 x 8
RAM 容量: 256 x 8
电压 - 电源 (Vcc/Vdd): 2.7 V ~ 5.5 V
数据转换器: A/D 6x12b; D/A 2x12b
振荡器型: 内部
工作温度: -40°C ~ 125°C
封装/外壳: 28-TSSOP(0.173",4.40mm 宽)
包装: 管件
配用: EVAL-ADUC814QSZ-ND - KIT DEV FOR ADUC814 MICROCONVRTR
ADuC814
Rev. A | Page 9 of 72
ABSOLUTE MAXIMUM RATINGS
Table 2. Temperature = 25°C, unless otherwise noted
Parameter
Rating
AVDD to AGND
–0.3 V to +7 V
DVDD to AGND
–0.3 V to +7 V
AVDD to DVDD
–0.3 V to +0.3 V
AGND to DGND1
–0.3 V to +0.3 V
Analog Input Voltage to AGND2
–0.3 V to AVDD + 0.3 V
Reference Input Voltage to AGND
–0.3 V to AVDD + 0.3 V
Analog Input Current (Indefinite)
30 mA
Reference Input Current (Indefinite)
30 mA
Digital Input Voltage to DGND
–0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND
–0.3 V to DVDD + 0.3 V
Operating Temperature Range
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
θJA Thermal Impedance
97.9°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
1 AGND and DGND are shorted internally on the ADuC814.
2 Applies to Pins P1.2 to P1.7 operating in analog or digital input mode.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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