参数资料
| 型号： | ADV3205JSTZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 19/21页 |
| 文件大小： | 0K |
| 描述： | IC CROSSPOINT SWIT 16X16 100LQFP |
| 标准包装： | 1 |
| 功能： | 交叉点开关 |
| 电路： | 1 x 16:16 |
| 电压电源： | 单/双电源 |
| 电压 - 电源，单路/双路(±)： | 4.5 V ~ 5.5 V，±5.5 V |
| 电流 - 电源： | 45mA |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 100-LQFP |
| 供应商设备封装： | 100-LQFP（14x14） |
| 包装： | 托盘 |
ADV3205
Data Sheet
Rev. 0 | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
POWER DISSIPATION
Table 6.
Parameter
Rating
Analog Supply Voltage (AVCC to AVEE)
12 V
Digital Supply Voltage (DVCC to DGND)
6 V
Ground Potential Difference (AGND to
DGND)
±0.5 V
3.1 W
Maintain linear output
Digital Input Voltage
DVCC
Output Voltage (Disabled Output)
(AVCC 1.5 V) to
(AVEE + 1.5 V)
Output Short-Circuit Duration
Momentary
Storage Temperature Range
65°C to +125°C
Lead Temperature (Soldering 10 sec)
300°C
Packaged in a 100-lead LQFP, the ADV3205 junction-to-ambient
thermal impedance (θJA) is 40°C/W. For long-term reliability,
the maximum allowed junction temperature of the plastic
encapsulated die should not exceed 150°C. Temporarily
exceeding this limit may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
The maximum ADV3205 power dissipation occurs when all
outputs are enabled and driving loads. Supply current increases
approximately linearly with the number of outputs that are enabled.
Refer to the Theory of Operation section for more details regarding
power dissipation calculations. Figure 4 indicates the maximum
ADV3205 power dissipation as a function of ambient temperature.
1 Specification is for device in free air (TA = 25°C):
100-lead plastic LQFP: θJA = 40°C/W.
2 To avoid differential input breakdown, in no case should one-half the output
voltage (1/2 VOUT) and any input voltage be greater than 10 V potential
differential. See the output voltage swing parameter in Table 1 for the linear
output range.
TJ = 150°C
AMBIENT TEMPERATURE (°C)
MA
XI
MU
M
PO
W
E
R
(W
)
4.0
3.5
3.0
2.5
2.0
10
0
2030
4050607
1
034
2-
00
4
0
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 4. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
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