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参数资料
| 型号： | ADV3229ACPZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 22/24页 |
| 文件大小： | 0K |
| 描述： | IC CROSSPOINT SW 16X8 72LFCSP |
| 标准包装： | 1 |
| 功能： | 交叉点开关 |
| 电路： | 1 x 8:8 |
| 电压电源： | 双电源 |
| 电压 - 电源，单路/双路(±)： | ±5V |
| 电流 - 电源： | 58mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 72-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 72-LFCSP-VQ（10x10） |
| 包装： | 托盘 |
ADV3228/ADV3229
Rev. 0 | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
POWER DISSIPATION
Table 5.
Parameter
Rating
Analog Supply Voltage (AVCC to AVEE)
11 V
Digital Supply Voltage (DVCC to DGND)
6 V
Supply Potential Difference (AVCC to DVCC)
±0.5 V
Ground Potential Difference
(AGND to DGND)
±0.5 V
Maximum Potential Difference
(DVCC to AVEE)
6 V
Analog Input Voltage
AVEE < VIN < AVCC
Digital Input Voltage
DGND < DIN < DVCC
Exposed Paddle Voltage
AGND
Output Voltage (Disabled Analog Output)
AVEE < VOUT < AVCC
Output Short-Circuit
Duration
Momentary
Current
Internally limited
to 55 mA
Temperature
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Junction Temperature
150°C
Lead Temperature
(Soldering, 10 sec)
300°C
The ADV3228/ADV3229 operate with ±5 V supplies and can
drive loads down to 100 Ω, resulting in a wide range of possible
power dissipations. For this reason, extra care must be taken when
derating the operating conditions based on ambient temperature.
Packaged in the 72-lead LFCSP, the ADV3228/ADV3229 junction-
to-ambient thermal impedance (θJA) is 29°C/W. For long-term
reliability, the maximum allowed junction temperature of the
die should not exceed 125°C; even temporarily exceeding this
limit can cause a shift in parametric performance due to a change
in stresses exerted on the die by the package. Exceeding a junction
temperature of 150°C for an extended period can result in device
failure. In Figure 4, the curve shows the range of allowed internal
die power dissipation that meets these conditions over the 40°C
to +85°C ambient temperature range. When using Figure 4, do
not include the external load power in the maximum power
calculation, but do include the load current dropped on the die
output transistors.
0
93
18
-00
4
0
1
2
3
4
5
6
7
–40
–20
0
20
40
60
80
M
A
X
IM
U
M
P
O
W
E
R
DI
S
IP
AT
IO
N
(
W
)
AMBIENT TEMPERATURE (°C)
TJ = 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature
ESD CAUTION
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
72-Lead LFCSP_VQ
29
0.5
°C/W
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