参数资料
型号: AG606-G
厂商: TRIQUINT SEMICONDUCTOR INC
元件分类: 放大器
英文描述: 50 MHz - 860 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封装: GREEN, MS-012, SOIC-8
文件页数: 4/5页
文件大小: 320K
代理商: AG606-G
TriQuint Semiconductor, Inc Phone +1-503-615-9000 FAX: +1-503-615-8900 e-mail: info-sales@tqs.com Web site: www.TriQuint.com
Page 4 of 5
July 2009
AG606
Push-Pull CATV Amplifier
75
Push-Pull Application Circuit Performance (Cont’d)
(Vsupply=7V, Rbias= 20.5
, 25 °°°°C)
P1dB vs. Frequency
14
16
18
20
22
24
0
200
400
600
800
1000
Frequency (MHz)
P
1
d
B
(d
B
m
)
+25°C
-40°C
+85°C
Noise Figure vs. Frequency
(Application Board)
2
3
4
5
6
7
0
200
400
600
800
1000
Frequency (MHz)
N
F
(d
B
)
+25°C
-40°C
+85°C
Noise Figure vs. Frequency at 25°C
(Device)
2
3
4
5
6
7
0
200
400
600
800
1000
Frequency (MHz)
N
F
(d
B
)
OIP3 vs. Frequency
1 MHz Spacing, +5dBm / Tone
30
32
34
36
38
40
0
200
400
600
800
1000
Frequency (MHz)
O
IP
3
(d
B
m
)
+25°C
-40°C
+85°C
OIP2 vs. Frequency
1 MHz Spacing, +5 dBm / Tone
60
65
70
75
80
85
0
200
400
600
800
1000
Frequency (MHz)
O
IP
2
(d
B
m
)
+25°C
-40°C
+85°C
XMOD, CTB and CSO vs. Frequency
@ 34 dBmV at 25°C
-100
-90
-80
-70
-60
-50
0
100
200
300
400
500
600
Frequency (MHz)
X
M
O
D
,C
T
B
a
n
d
C
S
O
(d
B
c
)
XMOD
CTB
CSO
CSO vs. Frequency
79 Channel Flat Loading, 34 dBmV
-100
-90
-80
-70
-60
-50
0
100
200
300
400
500
600
Frequency (MHz)
C
S
O
(d
B
c
)
-40°C
+25°C
+85°C
CTB vs. Frequency
79 Channel Flat Loading, 34 dBmV
-100
-90
-80
-70
-60
-50
0
100
200
300
400
500
600
Frequency (MHz)
C
T
B
(d
B
c
)
-40°C
+25°C
+85°C
XMOD vs. Frequency
79 Channel Flat Loading, 34 dBmV
-100
-90
-80
-70
-60
-50
0
100
200
300
400
500
600
Frequency (MHz)
X
M
O
D
(d
B
c
)
-40°C
+25°C
+85°C
CSO vs. Frequency
79 Channel Flat Loading at 25°C
-100
-90
-80
-70
-60
-50
0
100
200
300
400
500
600
Frequency (MHz)
C
S
O
(d
B
c
)
30 dBmV
32 dBmV
34 dBmV
36 dBmV
38 dBmV
CTB vs. Frequency
79 Channel Flat Loading at 25°C
-100
-90
-80
-70
-60
-50
0
100
200
300
400
500
600
Frequency (MHz)
C
T
B
(d
B
c
)
30 dBmV
32 dBmv
34 dBmV
36 dBmV
38 dBmV
XMOD vs. Frequency
79 Channel Flat Loading at 25°C
-100
-90
-80
-70
-60
-50
0
100
200
300
400
500
600
Frequency (MHz)
X
M
O
D
(d
B
c
)
30 dBmV
32 dBmV
34 dBmV
36 dBmV
38 dBmV
相关PDF资料
PDF描述
AGC-553 10 MHz - 500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AGC-7-30/10AC 25 MHz - 35 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
AGC-7-30/10A 25 MHz - 35 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
AGC-7-70/30AC 55 MHz - 85 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
AGC-7-21.4/10A 16.4 MHz - 26.4 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
相关代理商/技术参数
参数描述
AG606-PCB 功能描述:射频开发工具 Push-Pull Eval Brd 14dB Gain RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V
AG606-S8TRG 制造商:TriQuint Semiconductor 功能描述:BROADBAND/CATV (75 OHM) MISC. AMPLIFIER
AG60P-5 功能描述:SINGLE O/P, DC-HV DC PCB MOUNT, 制造商:xp power 系列:XP EMCO - AG 包装:盒 零件状态:有效 类型:高电压 - 隔离模块 输出数:1 电压 - 输入(最小值):0.7V 电压 - 输入(最大值):5V 电压 - 输出 1:6000V 电压 - 输出 2:- 电压 - 输出 3:- 电流 - 输出(最大值):1.67mA 功率(W) - 制造系列:1W 电压 - 隔离:500V 应用:ITE(商业) 特性:SCP 安装类型:表面贴装 封装/外壳:5-SMD 模块 大小/尺寸:1.13" 长 x 0.45" 宽 x 0.25" 高(28.7mm x 11.4mm x 6.4mm) 工作温度:-25°C ~ 75°C 效率:- 功率(W) - 最大值:1W 标准包装:1
AG611 制造商:CIF 功能描述:TINNER COPPER PADS 1 SIDE 100X160MM 制造商:CIF 功能描述:TINNER COPPER PADS 1 SIDE 100X160MM; Board Material:Epoxy; External Height:160mm; External Width:160mm; Board Connector / Footprint:DIN41612; SVHC:No SVHC (19-Dec-2012); External Length / Height:160mm; Material:Epoxy 16/10; PCB Hole ;RoHS Compliant: Yes
AG6124-SM 制造商:Panasonic Industrial Company 功能描述:SERVICE MANUAL