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参数资料
| 型号： | AG606-G |
| 厂商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分类： | 放大器 |
| 英文描述： | 50 MHz - 860 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | GREEN, MS-012, SOIC-8 |
| 文件页数： | 5/5页 |
| 文件大小： | 320K |
| 代理商： | AG606-G |
TriQuint Semiconductor, Inc Phone +1-503-615-9000 FAX: +1-503-615-8900 e-mail: info-sales@tqs.com Web site: www.TriQuint.com
Page 5 of 5
July 2009
AG606
Push-Pull CATV Amplifier
AG606-G (Lead-Free Package) Mechanical Information
This package is lead-free /green/ RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Land Pattern
Product Marking
The
AG606
will
be
marked
with
an
“AG606G” designator with a lot code marked
below the part designator. The “Y” represents
the last digit of the year the part was
manufactured, the “XXX” is an auto-generated
number, and “Z” refers to a wafer number in a
lot batch.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Class 1C
Value:
1000 to 2000 V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating:
Class IV
Value
Passes greater than 1000 V
Test:
Charge Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260 °C convection reflow
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
1.
Ground / thermal vias are critical for the proper performance
of this device.
Vias should use a .35mm (#80/.0135”)
diameter drill and have a final plated through diameter of
.25mm (.010”)
2.
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3.
To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
4.
Add mounting screws near the part to fasten the board to a
heatsink.
Ensure that the ground / thermal via region
contacts the heatsink.
5.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
6.
RF trace width depends upon the PC board material and
construction.
7.
Use 1 oz. Copper minimum.
8.
If the PCB design rules allow, ground vias should be placed
under
the
land
pattern
for
better
RF
and
thermal
performance.
Otherwise ground vias should be placed as
close to the land pattern as possible.
9.
All dimensions are in mm. Angles are in degrees.
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