参数资料
型号: AGLE3000V2-FGG896I
厂商: Microsemi SoC
文件页数: 110/166页
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
标准包装: 27
系列: IGLOOe
逻辑元件/单元数: 75264
RAM 位总计: 516096
输入/输出数: 620
门数: 3000000
电源电压: 1.14 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 896-BGA
供应商设备封装: 896-FBGA(31x31)
IGLOOe DC and Switching Characteristics
2-34
Revision 13
1.2 V DC Core Voltage
Table 2-38 3.3 V LVTTL / 3.3 V LVCMOS Low Slew – Applies to 1.2 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V
Drive Strength Speed Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL
tZH
tLZ
tHZ
tZLS
tZHS Units
4 mA
Std.
1.55 5.54 0.26 1.31 1.58 1.10 5.63 4.53 2.79 2.87 11.42 10.32
ns
8 mA
Std.
1.55 4.60 0.26 1.31 1.58 1.10 4.67 3.94 3.09 3.45 10.45 9.73
ns
12 mA
Std.
1.55 3.93 0.26 1.31 1.58 1.10 3.99 3.51 3.28 3.82 9.77
9.29
ns
16 mA
Std.
1.55 3.74 0.26 1.31 1.58 1.10 3.79 3.41 3.32 3.92 9.58
9.20
ns
24 mA
Std.
1.55 3.64 0.26 1.31 1.58 1.10 3.69 3.42 3.38 4.30 9.48
9.21
ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-6 for derating values.
Table 2-39 3.3 V LVTTL / 3.3 V LVCMOS High Slew – Applies to 1.2 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V
Drive Strength Speed Grade tDOUT tDP tDIN tPY tPYS tEOUT tZL
tZH
tLZ
tHZ
tZLS
tZHS Units
4 mA
Std.
1.55 3.26 0.26 1.31 1.58 1.10 3.33 2.67 2.79 3.01 9.12
8.46
ns
8 mA
Std.
1.55 2.77 0.26 1.31 1.58 1.10 2.80 2.24 3.09 3.59 8.59
8.03
ns
12 mA
Std.
1.55 2.47 0.26 1.31 1.58 1.10 2.51 2.04 3.28 3.97 8.29
7.82
ns
16 mA
Std.
1.55 2.42 0.26 1.31 1.58 1.10 2.46 2.00 3.33 4.08 8.24
7.79
ns
24 mA
Std.
1.55 2.45 0.26 1.31 1.58 1.10 2.48 1.95 3.38 4.46 8.26
7.73
ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-6 for derating values.
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