参数资料
型号: AGLE3000V2-FGG896I
厂商: Microsemi SoC
文件页数: 99/166页
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
标准包装: 27
系列: IGLOOe
逻辑元件/单元数: 75264
RAM 位总计: 516096
输入/输出数: 620
门数: 3000000
电源电压: 1.14 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 896-BGA
供应商设备封装: 896-FBGA(31x31)
IGLOOe DC and Switching Characteristics
2-24
Revision 13
Table 2-24 I/O AC Parameter Definitions
Parameter
Definition
tDP
Data to Pad delay through the Output Buffer
tPY
Pad to Data delay through the Input Buffer with Schmitt trigger disabled
tDOUT
Data to Output Buffer delay through the I/O interface
tEOUT
Enable to Output Buffer Tristate Control delay through the I/O interface
tDIN
Input Buffer to Data delay through the I/O interface
tPYS
Pad to Data delay through the Input Buffer with Schmitt trigger enabled
tHZ
Enable to Pad delay through the Output Buffer—HIGH to Z
tZH
Enable to Pad delay through the Output Buffer—Z to HIGH
tLZ
Enable to Pad delay through the Output Buffer—LOW to Z
tZL
Enable to Pad delay through the Output Buffer—Z to LOW
tZHS
Enable to Pad delay through the Output Buffer with delayed enable—Z to HIGH
tZLS
Enable to Pad delay through the Output Buffer with delayed enable—Z to LOW
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