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参数资料
| 型号： | AGLN125V2-VQG100 |
| 厂商： | Microsemi SoC |
| 文件页数： | 129/150页 |
| 文件大小： | 0K |
| 描述： | IC FPGA 125K 1.2-1.5V 100VTQFP |
| 标准包装： | 90 |
| 系列： | IGLOO nano |
| 逻辑元件/单元数： | 3072 |
| RAM 位总计： | 36864 |
| 输入/输出数： | 71 |
| 门数： | 125000 |
| 电源电压： | 1.14 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -20°C ~ 70°C |
| 封装/外壳： | 100-TQFP |
| 供应商设备封装： | 100-VQFP（14x14） |
| 其它名称： | 1100-1131 |
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IGLOO nano Device Overview
1-2
Revision 17
Flash Advantages
Low Power
Flash-based IGLOO nano devices exhibit power characteristics similar to those of an ASIC, making them
an ideal choice for power-sensitive applications. IGLOO nano devices have only a very limited power-on
current surge and no high-current transition period, both of which occur on many FPGAs.
IGLOO nano devices also have low dynamic power consumption to further maximize power savings;
power is reduced even further by the use of a 1.2 V core voltage.
Low dynamic power consumption, combined with low static power consumption and Flash*Freeze
technology, gives the IGLOO nano device the lowest total system power offered by any FPGA.
Security
Nonvolatile, flash-based IGLOO nano devices do not require a boot PROM, so there is no vulnerable
external bitstream that can be easily copied. IGLOO nano devices incorporate FlashLock, which provides
a unique combination of reprogrammability and design security without external overhead, advantages
that only an FPGA with nonvolatile flash programming can offer.
IGLOO nano devices utilize a 128-bit flash-based lock and a separate AES key to provide the highest
level of security in the FPGA industry for programmed intellectual property and configuration data. In
addition, all FlashROM data in IGLOO nano devices can be encrypted prior to loading, using the
industry-leading AES-128 (FIPS192) bit block cipher encryption standard. AES was adopted by the
National Institute of Standards and Technology (NIST) in 2000 and replaces the 1977 DES standard.
IGLOO nano devices have a built-in AES decryption engine and a flash-based AES key that make them
the most comprehensive programmable logic device security solution available today. IGLOO nano
devices with AES-based security provide a high level of protection for remote field updates over public
networks such as the Internet, and are designed to ensure that valuable IP remains out of the hands of
system overbuilders, system cloners, and IP thieves.
Security, built into the FPGA fabric, is an inherent component of IGLOO nano devices. The flash cells are
located beneath seven metal layers, and many device design and layout techniques have been used to
make invasive attacks extremely difficult. IGLOO nano devices, with FlashLock and AES security, are
unique in being highly resistant to both invasive and noninvasive attacks. Your valuable IP is protected
with industry-standard security, making remote ISP possible. An IGLOO nano device provides the best
available security for programmable logic designs.
Single Chip
Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed, the
configuration data is an inherent part of the FPGA structure, and no external configuration data needs to
be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based IGLOO nano
FPGAs do not require system configuration components such as EEPROMs or microcontrollers to load
device configuration data. This reduces bill-of-materials costs and PCB area, and increases security and
system reliability.
Instant On
Microsemi flash-based IGLOO nano devices support Level 0 of the Instant On classification standard.
This feature helps in system component initialization, execution of critical tasks before the processor
wakes up, setup and configuration of memory blocks, clock generation, and bus activity management.
The Instant On feature of flash-based IGLOO nano devices greatly simplifies total system design and
reduces total system cost, often eliminating the need for CPLDs and clock generation PLLs. In addition,
glitches and brownouts in system power will not corrupt the IGLOO nano device's flash configuration,
and unlike SRAM-based FPGAs, the device will not have to be reloaded when system power is restored.
This enables the reduction or complete removal of the configuration PROM, expensive voltage monitor,
brownout detection, and clock generator devices from the PCB design. Flash-based IGLOO nano
devices simplify total system design and reduce cost and design risk while increasing system reliability
and improving system initialization time.
IGLOO nano flash FPGAs enable the user to quickly enter and exit Flash*Freeze mode. This is done
almost instantly (within 1 s) and the device retains configuration and data in registers and RAM. Unlike
SRAM-based FPGAs, the device does not need to reload configuration and design state from external
memory components; instead it retains all necessary information to resume operation immediately.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AGLN125V2-VQG100I | 功能描述:IC FPGA NANO 1KB 125K 100VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| AGLN125V2-ZCSG81 | 功能描述:IC FPGA NANO 1KB 125K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| AGLN125V2-ZCSG81I | 功能描述:IC FPGA NANO 1KB 125K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| AGLN125V2-ZQNG100 | 制造商:Microsemi Corporation 功能描述:FPGA IGLOO NANO FAMILY 125K GATES 130NM (CMOS) TECHNOLOGY 1. - Trays |
| AGLN125V2-ZVQ100 | 功能描述:IC FPGA NANO 1KB 125K 100VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
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